Inventor
KUROKAWA TEPPEI
JP14 patents
⚠️ This page may combine multiple inventors who share the name “KUROKAWA TEPPEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOYO KOHAN CO LTD
13 patentsUS10748678B2Aug 18, 2020
Substrate for superconducting wire, production method therefor, and superconducting wire
TOYO KOHAN CO LTD3 citations71
US11453203B2Sep 27, 2022
Roll-bonded laminate and method for producing the same
TOYO KOHAN CO LTD2 citations70
US12070923B2Aug 27, 2024
Substrate for epitaxial growth and method for producing same
TOYO KOHAN CO LTD0 citations61
US11524486B2Dec 13, 2022
Substrate for epitaxtail, growth and method for producing same
TOYO KOHAN CO LTD0 citations61
US11407202B2Aug 9, 2022
Roll-bonded laminate, method for producing the same, and heat radiation reinforcement member for electronic equipment
TOYO KOHAN CO LTD0 citations61
US11590603B2Feb 28, 2023
Roll-bonded body and method for producing same
TOYO KOHAN CO LTD0 citations60
US11840045B2Dec 12, 2023
Roll-bonded laminate
TOYO KOHAN CO LTD0 citations59
US10864596B2Dec 15, 2020
Metal laminate material and production method therefor
TOYO KOHAN CO LTD1 citations59
US10174420B2Jan 8, 2019
Method for forming oxide layer, laminated substrate for epitaxial growth, and method for producing the same
TOYO KOHAN CO LTD0 citations50
US11878363B2Jan 23, 2024
Roll-bonded body and method for producing roll-bonded body
TOYO KOHAN CO LTD0 citations49
US10259073B2Apr 16, 2019
Method for producing metal laminate material
TOYO KOHAN CO LTD0 citations49
US10115501B2Oct 30, 2018
Substrate for superconducting wire, method for manufacturing the same, and superconducting wire
TOYO KOHAN CO LTD0 citations49
US10087552B2Oct 2, 2018
Substrate for epitaxial growth, manufacturing method therefor, and substrate for superconducting wire
TOYO KOHAN CO LTD0 citations49