Inventor

LOOI WAN LAY

MY5 patents

⚠️ This page may combine multiple inventors who share the name “LOOI WAN LAY”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STATS CHIPPAC LTD

2 patents

US8008770B2Aug 30, 2011

Integrated circuit package system with bump pad

STATS CHIPPAC LTD22 citations91

US7381634B2Jun 3, 2008

Integrated circuit system for bonding

STATS CHIPPAC LTD2 citations62

ST ASSEMBLY TEST SERVICES LTD

2 patents

US7443039B2Oct 28, 2008

System for different bond pads in an integrated circuit package

ST ASSEMBLY TEST SERVICES LTD3 citations59

US7005370B2Feb 28, 2006

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

ST ASSEMBLY TEST SERVICES LTD2 citations59

LIN YAOJIAN

1 patent

US8134196B2Mar 13, 2012

Integrated circuit system with metal-insulator-metal circuit element

LIN YAOJIAN0 citations50