Inventor

AUNG KYAW OO

SG3 patents

⚠️ This page may combine multiple inventors who share the name “AUNG KYAW OO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ST ASSEMBLY TEST SERVICES LTD

2 patents

US7443039B2Oct 28, 2008

System for different bond pads in an integrated circuit package

ST ASSEMBLY TEST SERVICES LTD3 citations59

US7005370B2Feb 28, 2006

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

ST ASSEMBLY TEST SERVICES LTD2 citations59

ZHAO XING

1 patent

US9281274B1Mar 8, 2016

Integrated circuit through-substrate via system with a buffer layer and method of manufacture thereof

ZHAO XING1 citations46