Inventor

JIN YONGGANG

SG43 patents

⚠️ This page may combine multiple inventors who share the name “JIN YONGGANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JIN YONGGANG

ST MICROELECTRONICS PTE LTD

System-in-packages and methods for forming same

Method of fabricating land grid array semiconductor package

Gas sensor device with frame passageways and related methods

Semiconductor optical package and method

Compact microelectronic integrated gas sensor

Embedded wafer level ball grid array bar systems and methods

Compact microelectronic integrated gas sensor

Method for making an optical proximity sensor by attaching an optical element to a package top plate and forming a package body to define an optical transmit cavity and an optical receive cavity

Optoelectronics assembly and method of making optoelectronics assembly

Semiconductor optical package and method

Electronic device including electrically conductive vias having different cross-sectional areas and related methods

Wafer level packaging, optical detection sensor and method of forming same

Wafer level packaging, optical detection sensor and method of forming same

Electronic device having a contact recess and related methods

Integrated circuit package and method of forming the same

Semiconductor packages with pillar and bump structures

Shielding techniques for an integrated circuit

GAN KAH WEE

Embedded wafer level package for 3D and package-on-package applications, and method of manufacture

Embedded wafer level package for 3D and package-on-package applications, and method of manufacture

Through hole via filling using electroless plating

Through hole via filling using electroless plating

Reconstituted wafer warpage adjustment

Plasma treatment on semiconductor wafers

Baidu online network technology beijing co ltd

Method, apparatus, and computer readable storage medium for updating electronic map

Method and apparatus for detecting lane line, and medium

Method and apparatus for creating map and positioning moving entity

Method and apparatus for fusing point cloud data

Method, apparatus, and computer readable medium for adjusting color annotation of an image

Method, apparatus, and device for determining lane line on road

JIN YONGGANG

Method of fabricating land grid array semiconductor package

Semiconductor package with improved pillar bump process and structure

Manufacturing fan-out wafer level packaging

Apparatus and method for placing solder balls

Reducing warpage for fan-out wafer level packaging

ST ASSEMBLY TEST SERVICES LTD

System for different bond pads in an integrated circuit package

Method of manufacturing different bond pads on the same substrate of an integrated circuit package

System for fabricating an integrated circuit package on a printed circuit board

ST MICROELECTRONICS ASIA

Method for making image sensors using wafer-level processing and associated devices

Image sensor device with IR filter and related methods

OIP TECH PTE LTD

Transmissive optical sensor and method of fabricating same

Silicon photonic package and method of fabricating the same

CHUA PUAY GEK

Method for producing vias in fan-out wafers using dry film and conductive paste, and a corresponding semiconductor package

CONTINENTAL AUTOMOTIVE GMBH

Device and method for calculating a vehicle trailer pose using a camera