Inventor
VICARD DOMINIQUE
FR26 patents
⚠️ This page may combine multiple inventors who share the name “VICARD DOMINIQUE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BRUN JEAN
6 patentsUS8258011B2Sep 4, 2012
Method for producing a set of chips mechanically interconnected by means of a flexible connection
BRUN JEAN16 citations92
US8258044B2Sep 4, 2012
Method for fabricating chip elements provided with wire insertion grooves
BRUN JEAN34 citations92
US8814054B2Aug 26, 2014
Inclusion of chip elements in a sheathed wire
BRUN JEAN32 citations90
US8723312B2May 13, 2014
Assembly of a wire element with a microelectronic chip with a groove comprising at least one bump securing the wire element
BRUN JEAN20 citations90
US8654540B2Feb 18, 2014
Method for assembling at least one chip with a wire element, electronic chip with a deformable link element, fabrication method of a plurality of chips, and assembly of at least one chip with a wire element
BRUN JEAN1 citations52
US8611101B2Dec 17, 2013
Assembly of a microelectronic chip having a groove with a wire element in the form of a strand, and method for assembly
BRUN JEAN1 citations49
VICARD DOMINIQUE
5 patentsUS9093289B2Jul 28, 2015
Method for assembling at least one chip using a fabric, and fabric including a chip device
VICARD DOMINIQUE64 citations97
US8782880B2Jul 22, 2014
Apparatus for assembling chip devices on wires
VICARD DOMINIQUE22 citations92
US8093617B2Jan 10, 2012
Bare microelectronic chip provided with a recess forming a housing for a wire element constituting a flexible mechanical support, fabrication process and microstructure
VICARD DOMINIQUE30 citations92
US8471773B2Jun 25, 2013
Assembly of radiofrequency chips
VICARD DOMINIQUE30 citations89
US9112079B2Aug 18, 2015
Photovoltaic cell, method for assembling plurality of cells and assembly of a plurality of photovoltaic cells
VICARD DOMINIQUE4 citations72
HEWLETT PACKARD DEVELOPMENT CO
5 patentsUS7296050B2Nov 13, 2007
Distributed computing system and method
HEWLETT PACKARD DEVELOPMENT CO26 citations92
US7251725B2Jul 31, 2007
Boot process for a computer, a boot ROM and a computer having a boot ROM
HEWLETT PACKARD DEVELOPMENT CO36 citations90
US7236863B2Jun 26, 2007
Docking station for a vehicle
HEWLETT PACKARD DEVELOPMENT CO46 citations87
US7047402B2May 16, 2006
Process for booting and causing completion of synchronization based on multiple actuations of designated key when the system is off
HEWLETT PACKARD DEVELOPMENT CO2 citations53
US7472271B2Dec 30, 2008
Methods and devices relating to distributed computing environments
HEWLETT PACKARD DEVELOPMENT CO0 citations47
COMMISSARIAT ENERGIE ATOMIQUE
5 patentsUS9888573B2Feb 6, 2018
Cap for a chip device having a groove, device provided with said cap, assembly consisting of the device and a wire element, and manufacturing method thereof
COMMISSARIAT ENERGIE ATOMIQUE2 citations73
US8375563B2Feb 19, 2013
Method for making an assembly of chips by means of radiofrequency transmission-reception means mechanically connected by a ribbon
COMMISSARIAT ENERGIE ATOMIQUE3 citations63
US8012795B2Sep 6, 2011
Method and device for fabricating an assembly of at least two microelectronic chips
COMMISSARIAT ENERGIE ATOMIQUE4 citations60
US10707363B2Jul 7, 2020
Assembly for housing wire elements
COMMISSARIAT ENERGIE ATOMIQUE0 citations52
US10452969B2Oct 22, 2019
Treatment device for electronic chips of an elongate element
COMMISSARIAT ENERGIE ATOMIQUE0 citations38
HEWLETT PACKARD CO
3 patentsUS5708715AJan 13, 1998
Integrated circuit device with function usage control
HEWLETT PACKARD CO56 citations96
US6003105ADec 14, 1999
Long-haul PCI-to-PCI bridge
HEWLETT PACKARD CO67 citations93
US5764761AJun 9, 1998
Eletronic assembly with integrated circuit devices including lock circuitry
HEWLETT PACKARD CO28 citations92