Inventor
HOSOMI EIICHI
US27 patents
⚠️ This page may combine multiple inventors who share the name “HOSOMI EIICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
25 patentsUS6111317AAug 29, 2000
Flip-chip connection type semiconductor integrated circuit device
TOSHIBA KK157 citations98
US6159837ADec 12, 2000
Manufacturing method of semiconductor device
TOSHIBA KK106 citations97
US5801447ASep 1, 1998
Flip chip mounting type semiconductor device
TOSHIBA KK107 citations97
US6376907B1Apr 23, 2002
Ball grid array type package for semiconductor device
TOSHIBA KK60 citations96
US5825081AOct 20, 1998
Tape carrier and assembly structure thereof
TOSHIBA KK60 citations96
US5773888AJun 30, 1998
Semiconductor device having a bump electrode connected to an inner lead
TOSHIBA KK84 citations96
US5747881AMay 5, 1998
Semiconductor device, method of fabricating the same and copper leads
TOSHIBA KK54 citations96
US5631499AMay 20, 1997
Semiconductor device comprising fine bump electrode having small side etch portion and stable characteristics
TOSHIBA KK118 citations96
US7087988B2Aug 8, 2006
Semiconductor packaging apparatus
TOSHIBA KK25 citations92
US6049130AApr 11, 2000
Semiconductor device using gold bumps and copper leads as bonding elements
TOSHIBA KK32 citations92
US6469373B2Oct 22, 2002
Semiconductor apparatus with improved thermal and mechanical characteristic under-fill layer and manufacturing method therefor
TOSHIBA KK45 citations90
US7531751B2May 12, 2009
Method and system for an improved package substrate for use with a semiconductor package
TOSHIBA KK18 citations84
US6768206B2Jul 27, 2004
Organic substrate for flip chip bonding
TOSHIBA KK17 citations84
US6551854B2Apr 22, 2003
Semiconductor device having bump electrodes and method of manufacturing the same
TOSHIBA KK10 citations73
US7910956B2Mar 22, 2011
Semiconductor device with interface circuit and method of configuring semiconductor devices
TOSHIBA KK5 citations63
US7817439B2Oct 19, 2010
System and apparatus for power distribution for a semiconductor device
TOSHIBA KK4 citations63
US7227260B2Jun 5, 2007
Method and system for a pad structure for use with a semiconductor package
TOSHIBA KK4 citations63
US6061466AMay 9, 2000
Apparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leads
TOSHIBA KK5 citations63
US7492570B2Feb 17, 2009
Systems and methods for reducing simultaneous switching noise in an integrated circuit
TOSHIBA KK3 citations62
US6960494B2Nov 1, 2005
Semiconductor package and method of manufacturing the same
TOSHIBA KK4 citations59
US6836012B2Dec 28, 2004
Semiconductor package and method of manufacturing the same
TOSHIBA KK2 citations59
US8723334B2May 13, 2014
Semiconductor device including semiconductor package
TOSHIBA KK0 citations52
US7501698B2Mar 10, 2009
Method and system for an improved power distribution network for use with a semiconductor device
TOSHIBA KK1 citations52
US5615822AApr 1, 1997
Method and apparatus for controlling bonding load of fine lead electrode
TOSHIBA KK0 citations52
US9153510B2Oct 6, 2015
Semiconductor device and method of manufacturing the same
TOSHIBA KK0 citations48