Inventor
HUNG CHI-CHENG
TW75 patents
⚠️ This page may combine multiple inventors who share the name “HUNG CHI-CHENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
42 patentsUS9620610B1Apr 11, 2017
FinFET gate structure and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD22 citations94
US10985061B2Apr 20, 2021
Methods for forming contact plugs with reduced corrosion
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10833196B2Nov 10, 2020
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10658184B2May 19, 2020
Pattern fidelity enhancement with directional patterning technology
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10483165B2Nov 19, 2019
Methods for forming contact plugs with reduced corrosion
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10186456B2Jan 22, 2019
Methods for forming contact plugs with reduced corrosion
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US10090206B2Oct 2, 2018
FinFET gate structure and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10049918B2Aug 14, 2018
Directional patterning methods
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations84
US9837507B1Dec 5, 2017
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US9947753B2Apr 17, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US12021147B2Jun 25, 2024
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11563120B2Jan 24, 2023
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10867845B2Dec 15, 2020
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10714357B2Jul 14, 2020
Methods for improved critical dimension uniformity in a semiconductor device fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10516034B2Dec 24, 2019
Semiconductor device and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10497811B2Dec 3, 2019
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269918B2Apr 23, 2019
N-work function metal with crystal structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10157998B2Dec 18, 2018
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10157785B2Dec 18, 2018
Semiconductor device and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9991132B2Jun 5, 2018
Lithographic technique incorporating varied pattern materials
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations73
US9870995B2Jan 16, 2018
Formation of copper layer structure with self anneal strain improvement
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9728407B2Aug 8, 2017
Method of forming features with various dimensions
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9449880B1Sep 20, 2016
Fin patterning methods for increased process margin
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations73
US10714576B2Jul 14, 2020
Semiconductor device and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10755938B2Aug 25, 2020
Metal gate and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US10146141B2Dec 4, 2018
Lithography process and system with enhanced overlay quality
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12356656B2Jul 8, 2025
FinFET structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11616132B2Mar 28, 2023
Semiconductor device and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11031486B2Jun 8, 2021
Semiconductor device and methods of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US9508817B2Nov 29, 2016
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US12507458B2Dec 23, 2025
Semiconductor device with dielectric spacer liner on source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955379B2Apr 9, 2024
Metal adhesion layer to promote metal plug adhesion
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901188B2Feb 13, 2024
Method for improved critical dimension uniformity in a semiconductor device fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11670690B2Jun 6, 2023
Semiconductor device with dielectric spacer liner on source/drain contact
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11289338B2Mar 29, 2022
Method for improved critical dimension uniformity in a semiconductor device fabrication process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11158509B2Oct 26, 2021
Pattern fidelity enhancement with directional patterning technology
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11133395B2Sep 28, 2021
N-work function metal with crystal structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9698019B2Jul 4, 2017
N-work function metal with crystal structure
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12068197B2Aug 20, 2024
Methods for forming contact plugs with reduced corrosion
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11271103B2Mar 8, 2022
Semiconductor device and manufacturing process thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US11043573B2Jun 22, 2021
Method of fabricating tantalum nitride barrier layer and semiconductor device thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US10840184B2Nov 17, 2020
Formation of copper layer structure with self anneal strain improvement
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
WINBOND ELECTRONICS CORP
3 patentsUS5864309AJan 26, 1999
Serial data timing base modulator
WINBOND ELECTRONICS CORP46 citations93
US5710573AJan 20, 1998
Scaled video output overlaid onto a computer graphics output
WINBOND ELECTRONICS CORP49 citations91
US6430630B1Aug 6, 2002
Direct data access between input and output ports
WINBOND ELECTRONICS CORP3 citations63
SDI CORP
2 patentsTAIWAN SEMICONDUCTOR MFG
1 patentHUNG CHI-CHENG
1 patentLYONTEK INC
1 patentShowing the top 50 of 75 patents by PatentIndex Score.