Inventor

HUNEKE JAMES T

US8 patents

⚠️ This page may combine multiple inventors who share the name “HUNEKE JAMES T”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HENKEL CORP

3 patents

US7312534B2Dec 25, 2007

Interlayer dielectric and pre-applied die attach adhesive materials

HENKEL CORP47 citations94

US7550825B2Jun 23, 2009

Interlayer dielectric and pre-applied die attach adhesive materials

HENKEL CORP18 citations91

US7582510B2Sep 1, 2009

Electronic packaging materials for use with low-k dielectric-containing semiconductor devices

HENKEL CORP10 citations82

DESIGNER MOLECULES INC

1 patent

US8710682B2Apr 29, 2014

Materials and methods for stress reduction in semiconductor wafer passivation layers

DESIGNER MOLECULES INC8 citations83

DERSHEM STEPHEN M

1 patent

US8415812B2Apr 9, 2013

Materials and methods for stress reduction in semiconductor wafer passivation layers

DERSHEM STEPHEN M10 citations83

HUNEKE JAMES T

1 patent

US8399974B1Mar 19, 2013

Methods of dicing stacked shingled strip constructions to form stacked die packages

HUNEKE JAMES T17 citations79

WESTERN ELECTRIC CO

1 patent

US4374869AFeb 22, 1983

Selective metal etch technique

WESTERN ELECTRIC CO21 citations79

AT & T TECHNOLOGIES INC

1 patent

US4574031AMar 4, 1986

Additive processing electroless metal plating using aqueous photoresist

AT & T TECHNOLOGIES INC25 citations78