Inventor

JI QING

US18 patents

⚠️ This page may combine multiple inventors who share the name “JI QING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JI QING

UNIV CALIFORNIA

Focused electron and ion beam systems

Focused ion beam system

Ion beam extractor with counterbore

Ion source with external RF antenna

High brightness—multiple beamlets source for patterned X-ray production

HENKEL CORP

Interlayer dielectric and pre-applied die attach adhesive materials

Interlayer dielectric and pre-applied die attach adhesive materials

UNIV CORNELL

Wafer-based charged particle accelerator, wafer components, methods, and applications

Wafer-based charged particle accelerator, wafer components, methods, and applications

CORNING INC

Supporting distributed massive multiple-input multiple-output (DM-MIMO) in a distributed communications system (DCS)

Supporting distributed massive multiple-input multiple-output (DM-MIMO) in a distributed communications system (DCS)

SHEYANG RESEARCH INSTITUTE OF NANJING UNIV

Laser heating single-sensor fast scanning calorimeter

KWAN JOE

RF-driven ion source with a back-streaming electron dump

NANJING UNIVERSITY OF TECHNOLOGY

Device and method for realizing high-speed temperature drop of micro material by droplet cooling

UNIV HOUSTON SYSTEM

Cyclobenzoins

JI QING

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

SCHENKEL THOMAS

Advanced penning ion source

CHAN CHEW B

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process