Inventor
SHIN YOUNG HWAN
KR36 patents
⚠️ This page may combine multiple inventors who share the name “SHIN YOUNG HWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRO MECH
16 patentsUS6405431B1Jun 18, 2002
Method for manufacturing build-up multi-layer printed circuit board by using yag laser
SAMSUNG ELECTRO MECH151 citations96
US7408261B2Aug 5, 2008
BGA package board and method for manufacturing the same
SAMSUNG ELECTRO MECH34 citations91
US7346982B2Mar 25, 2008
Method of fabricating printed circuit board having thin core layer
SAMSUNG ELECTRO MECH26 citations91
US6852625B2Feb 8, 2005
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
SAMSUNG ELECTRO MECH18 citations90
US7387917B2Jun 17, 2008
BGA package substrate and method of fabricating same
SAMSUNG ELECTRO MECH13 citations84
US7256495B2Aug 14, 2007
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
SAMSUNG ELECTRO MECH11 citations84
US9526169B2Dec 20, 2016
Printed circuit board and method for manufacturing the same
SAMSUNG ELECTRO MECH3 citations72
US7208349B2Apr 24, 2007
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
SAMSUNG ELECTRO MECH5 citations63
US7802361B2Sep 28, 2010
Method for manufacturing the BGA package board
SAMSUNG ELECTRO MECH3 citations61
US7768116B2Aug 3, 2010
Semiconductor package substrate having different thicknesses between wire bonding pad and ball pad and method for fabricating the same
SAMSUNG ELECTRO MECH2 citations61
US7030500B2Apr 18, 2006
Package substrate manufactured using electrolytic leadless plating process, and method for manufacturing the same
SAMSUNG ELECTRO MECH4 citations60
US7629692B2Dec 8, 2009
Via hole having fine hole land and method for forming the same
SAMSUNG ELECTRO MECH1 citations52
US8809122B2Aug 19, 2014
Method of manufacturing flip chip package
SAMSUNG ELECTRO MECH0 citations49
US7795719B2Sep 14, 2010
Electro component package
SAMSUNG ELECTRO MECH1 citations49
US7807215B2Oct 5, 2010
Method of manufacturing copper-clad laminate for VOP application
SAMSUNG ELECTRO MECH0 citations40
US7298887B2Nov 20, 2007
System for and method of analyzing surface condition of PCB using RGB colors
SAMSUNG ELECTRO MECH0 citations40
HYUNDAI MOTOR CO LTD
8 patentsUSD952213SMay 17, 2022
Rear combination lamp for an automobile
HYUNDAI MOTOR CO LTD25 citations93
USD950817SMay 3, 2022
Rear combination lamp for an automobile
HYUNDAI MOTOR CO LTD23 citations93
USD950816SMay 3, 2022
Rear combination lamp for an automobile
HYUNDAI MOTOR CO LTD24 citations93
USD952212SMay 17, 2022
Rear combination lamp for an automobile
HYUNDAI MOTOR CO LTD16 citations86
USD951503SMay 10, 2022
Head lamp for an automobile
HYUNDAI MOTOR CO LTD7 citations84
USD1097248SOct 7, 2025
Head lamp for automobile
HYUNDAI MOTOR CO LTD4 citations73
USD1110555SJan 27, 2026
Head lamp for automobile
HYUNDAI MOTOR CO LTD0 citations61
USD1109906SJan 20, 2026
Center position lamp for automobile
HYUNDAI MOTOR CO LTD0 citations61