Inventor
PARK SUNG-KEUN
KR19 patents
⚠️ This page may combine multiple inventors who share the name “PARK SUNG-KEUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
6 patentsUS10790255B2Sep 29, 2020
Fan-out semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations71
US10847474B2Nov 24, 2020
Semiconductor package and electromagnetic interference shielding structure for the same
SAMSUNG ELECTRONICS CO LTD1 citations61
US7412176B2Aug 12, 2008
Method of processing an error of an image forming apparatus
SAMSUNG ELECTRONICS CO LTD2 citations61
US10923420B2Feb 16, 2021
Semiconductor device including dummy contact
SAMSUNG ELECTRONICS CO LTD0 citations51
US10643857B2May 5, 2020
Method of generating layout and method of manufacturing semiconductor devices using same
SAMSUNG ELECTRONICS CO LTD0 citations48
US11127692B2Sep 21, 2021
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations43
LIM CHANG HYUN
4 patentsUS8686295B2Apr 1, 2014
Heat-dissipating substrate and fabricating method thereof
LIM CHANG HYUN0 citations51
US8603842B2Dec 10, 2013
Method of manufacturing package substrate for optical element
LIM CHANG HYUN1 citations51
US8558359B2Oct 15, 2013
Semiconductor package having lead frames
LIM CHANG HYUN1 citations50
US8315056B2Nov 20, 2012
Heat-radiating substrate and method of manufacturing the same
LIM CHANG HYUN1 citations49