P

Inventor

TAKEWAKI TOSHIYUKI

JP52 patents
⚠️ This page may combine multiple inventors who share the name “TAKEWAKI TOSHIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NEC ELECTRONICS CORP

24 patents
US7312535B2Dec 25, 2007

Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer

NEC ELECTRONICS CORP26 citations92
US7229921B2Jun 12, 2007

Semiconductor device and manufacturing method for the same

NEC ELECTRONICS CORP27 citations92
US6949832B2Sep 27, 2005

Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof

NEC ELECTRONICS CORP18 citations92
US7728432B2Jun 1, 2010

Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces

NEC ELECTRONICS CORP12 citations84
US7479700B2Jan 20, 2009

Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same

NEC ELECTRONICS CORP10 citations84
US7476611B2Jan 13, 2009

Semiconductor device and manufacturing method thereof

NEC ELECTRONICS CORP9 citations84
US7327031B2Feb 5, 2008

Semiconductor device and method of manufacturing the same

NEC ELECTRONICS CORP9 citations84
US7846830B2Dec 7, 2010

Semiconductor device and method for manufacturing same

NEC ELECTRONICS CORP11 citations83
US6890864B2May 10, 2005

Semiconductor device fabricating method and treating liquid

NEC ELECTRONICS CORP12 citations83
US7692265B2Apr 6, 2010

Fuse and seal ring

NEC ELECTRONICS CORP7 citations74
US7737555B2Jun 15, 2010

Semiconductor method having silicon-diffused metal wiring layer

NEC ELECTRONICS CORP6 citations73
US7687917B2Mar 30, 2010

Single damascene structure semiconductor device having silicon-diffused metal wiring layer

NEC ELECTRONICS CORP7 citations73
US7745937B2Jun 29, 2010

Semiconductor device and method of manufacturing the same

NEC ELECTRONICS CORP4 citations63
US7741214B2Jun 22, 2010

Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon

NEC ELECTRONICS CORP3 citations63
US7633138B2Dec 15, 2009

Semiconductor device and method of manufacturing the same

NEC ELECTRONICS CORP3 citations63
US7508082B2Mar 24, 2009

Semiconductor device and method of manufacturing the same

NEC ELECTRONICS CORP3 citations63
US7274104B2Sep 25, 2007

Semiconductor device having an interconnect that increases in impurity concentration as width increases

NEC ELECTRONICS CORP4 citations63
US6555911B1Apr 29, 2003

Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios

NEC ELECTRONICS CORP4 citations63
US7358609B2Apr 15, 2008

Semiconductor device

NEC ELECTRONICS CORP4 citations62
US7821101B2Oct 26, 2010

Semiconductor device including capacitor including upper electrode covered with high density insulation film and production method thereof

NEC ELECTRONICS CORP0 citations52
US7674704B2Mar 9, 2010

Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases

NEC ELECTRONICS CORP0 citations52
US7514352B2Apr 7, 2009

Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases

NEC ELECTRONICS CORP0 citations52
US7601640B2Oct 13, 2009

Method of manfacturing semiconductor device

NEC ELECTRONICS CORP0 citations49
US7521802B2Apr 21, 2009

Semiconductor device having a refractory metal containing film and method for manufacturing the same

NEC ELECTRONICS CORP1 citations46

RENESAS ELECTRONICS CORP

14 patents
US9559183B2Jan 31, 2017

Semiconductor device with varying thickness of insulating film between electrode and gate electrode and method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP14 citations92
US9306027B2Apr 5, 2016

Semiconductor device and a method for manufacturing a semiconductor device

RENESAS ELECTRONICS CORP13 citations84
US8053863B2Nov 8, 2011

Electrical fuse and semiconductor device

RENESAS ELECTRONICS CORP7 citations84
US9984884B2May 29, 2018

Method of manufacturing semiconductor device with a multi-layered gate dielectric

RENESAS ELECTRONICS CORP3 citations73
US9070661B2Jun 30, 2015

Semiconductor device including a strain relaxation film

RENESAS ELECTRONICS CORP3 citations63
US8030737B2Oct 4, 2011

Semiconductor device and method of manufacturing the same

RENESAS ELECTRONICS CORP3 citations62
US7842602B2Nov 30, 2010

Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method

RENESAS ELECTRONICS CORP3 citations62
US7888254B2Feb 15, 2011

Semiconductor device having a refractory metal containing film and method for manufacturing the same

RENESAS ELECTRONICS CORP2 citations57
US10410868B2Sep 10, 2019

Semiconductor device and method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP0 citations52
US9660045B2May 23, 2017

Semiconductor device and a method for manufacturing a semiconductor device

RENESAS ELECTRONICS CORP1 citations52
US9362401B2Jun 7, 2016

Semiconductor device

RENESAS ELECTRONICS CORP0 citations52
US7936072B2May 3, 2011

Semiconductor device having dual damascene structure

RENESAS ELECTRONICS CORP1 citations52
US7897475B2Mar 1, 2011

Semiconductor device having projection on lower electrode and method for forming the same

RENESAS ELECTRONICS CORP0 citations52
US7955980B2Jun 7, 2011

Method of manufacturing semiconductor device

RENESAS ELECTRONICS CORP0 citations49

NEC CORP

3 patents

OSHIDA DAISUKE

2 patents

OHTO KOICHI

2 patents

TAKEWAKI TOSHIYUKI

2 patents

OHMI TADAHIRO

1 patent

TOSHIBA KK

1 patent

TOSHIBA MEMORY CORP

1 patent

Showing the top 50 of 52 patents by PatentIndex Score.