Inventor
TAKEWAKI TOSHIYUKI
JP52 patents
⚠️ This page may combine multiple inventors who share the name “TAKEWAKI TOSHIYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NEC ELECTRONICS CORP
24 patentsUS7312535B2Dec 25, 2007
Semiconductor device having an anti-oxidizing layer that inhibits corrosion of an interconnect layer
NEC ELECTRONICS CORP26 citations92
US7229921B2Jun 12, 2007
Semiconductor device and manufacturing method for the same
NEC ELECTRONICS CORP27 citations92
US6949832B2Sep 27, 2005
Semiconductor device including dissimilar element-diffused metal layer and manufacturing method thereof
NEC ELECTRONICS CORP18 citations92
US7728432B2Jun 1, 2010
Narrow and wide copper interconnections composed of (111), (200) and (511) surfaces
NEC ELECTRONICS CORP12 citations84
US7479700B2Jan 20, 2009
Semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thickness formed thereon, and method for manufacturing the same
NEC ELECTRONICS CORP10 citations84
US7476611B2Jan 13, 2009
Semiconductor device and manufacturing method thereof
NEC ELECTRONICS CORP9 citations84
US7327031B2Feb 5, 2008
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP9 citations84
US7846830B2Dec 7, 2010
Semiconductor device and method for manufacturing same
NEC ELECTRONICS CORP11 citations83
US6890864B2May 10, 2005
Semiconductor device fabricating method and treating liquid
NEC ELECTRONICS CORP12 citations83
US7692265B2Apr 6, 2010
Fuse and seal ring
NEC ELECTRONICS CORP7 citations74
US7737555B2Jun 15, 2010
Semiconductor method having silicon-diffused metal wiring layer
NEC ELECTRONICS CORP6 citations73
US7687917B2Mar 30, 2010
Single damascene structure semiconductor device having silicon-diffused metal wiring layer
NEC ELECTRONICS CORP7 citations73
US7745937B2Jun 29, 2010
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP4 citations63
US7741214B2Jun 22, 2010
Method of forming a semiconductor device featuring copper wiring layers of different widths having metal capping layers of different thicknesses formed thereon
NEC ELECTRONICS CORP3 citations63
US7633138B2Dec 15, 2009
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP3 citations63
US7508082B2Mar 24, 2009
Semiconductor device and method of manufacturing the same
NEC ELECTRONICS CORP3 citations63
US7274104B2Sep 25, 2007
Semiconductor device having an interconnect that increases in impurity concentration as width increases
NEC ELECTRONICS CORP4 citations63
US6555911B1Apr 29, 2003
Semiconductor device and method of manufacturing interconnections thereof using copper and tungsten in predetermined ratios
NEC ELECTRONICS CORP4 citations63
US7358609B2Apr 15, 2008
Semiconductor device
NEC ELECTRONICS CORP4 citations62
US7821101B2Oct 26, 2010
Semiconductor device including capacitor including upper electrode covered with high density insulation film and production method thereof
NEC ELECTRONICS CORP0 citations52
US7674704B2Mar 9, 2010
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
NEC ELECTRONICS CORP0 citations52
US7514352B2Apr 7, 2009
Method of manufacturing a semiconductor device having an interconnect structure that increases in impurity concentration as width increases
NEC ELECTRONICS CORP0 citations52
US7601640B2Oct 13, 2009
Method of manfacturing semiconductor device
NEC ELECTRONICS CORP0 citations49
US7521802B2Apr 21, 2009
Semiconductor device having a refractory metal containing film and method for manufacturing the same
NEC ELECTRONICS CORP1 citations46
RENESAS ELECTRONICS CORP
14 patentsUS9559183B2Jan 31, 2017
Semiconductor device with varying thickness of insulating film between electrode and gate electrode and method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP14 citations92
US9306027B2Apr 5, 2016
Semiconductor device and a method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP13 citations84
US8053863B2Nov 8, 2011
Electrical fuse and semiconductor device
RENESAS ELECTRONICS CORP7 citations84
US9984884B2May 29, 2018
Method of manufacturing semiconductor device with a multi-layered gate dielectric
RENESAS ELECTRONICS CORP3 citations73
US9070661B2Jun 30, 2015
Semiconductor device including a strain relaxation film
RENESAS ELECTRONICS CORP3 citations63
US8030737B2Oct 4, 2011
Semiconductor device and method of manufacturing the same
RENESAS ELECTRONICS CORP3 citations62
US7842602B2Nov 30, 2010
Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method
RENESAS ELECTRONICS CORP3 citations62
US7888254B2Feb 15, 2011
Semiconductor device having a refractory metal containing film and method for manufacturing the same
RENESAS ELECTRONICS CORP2 citations57
US10410868B2Sep 10, 2019
Semiconductor device and method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US9660045B2May 23, 2017
Semiconductor device and a method for manufacturing a semiconductor device
RENESAS ELECTRONICS CORP1 citations52
US9362401B2Jun 7, 2016
Semiconductor device
RENESAS ELECTRONICS CORP0 citations52
US7936072B2May 3, 2011
Semiconductor device having dual damascene structure
RENESAS ELECTRONICS CORP1 citations52
US7897475B2Mar 1, 2011
Semiconductor device having projection on lower electrode and method for forming the same
RENESAS ELECTRONICS CORP0 citations52
US7955980B2Jun 7, 2011
Method of manufacturing semiconductor device
RENESAS ELECTRONICS CORP0 citations49
NEC CORP
3 patentsUS6391774B1May 21, 2002
Fabrication process of semiconductor device
NEC CORP25 citations92
US6379782B2Apr 30, 2002
Semiconductor device formed with metal wiring on a wafer by chemical mechanical polishing, and method of manufacturing the same
NEC CORP21 citations92
US6458690B2Oct 1, 2002
Method for manufacturing a multilayer interconnection structure
NEC CORP6 citations63
OSHIDA DAISUKE
2 patentsOHTO KOICHI
2 patentsTAKEWAKI TOSHIYUKI
2 patentsOHMI TADAHIRO
1 patentTOSHIBA KK
1 patentTOSHIBA MEMORY CORP
1 patentShowing the top 50 of 52 patents by PatentIndex Score.