Inventor
HIRASAWA KAZUYA
JP8 patents
⚠️ This page may combine multiple inventors who share the name “HIRASAWA KAZUYA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
DENSO CORP
3 patentsUS11335628B2May 17, 2022
Semiconductor package, semiconductor device and semiconductor package manufacturing method
DENSO CORP0 citations59
US11127702B2Sep 21, 2021
Semiconductor device and method for manufacturing same
DENSO CORP0 citations54
US10809144B2Oct 20, 2020
Physical quantity sensor and method for manufacturing same
DENSO CORP0 citations40