Inventor
OLSON KEVIN C
US27 patents
⚠️ This page may combine multiple inventors who share the name “OLSON KEVIN C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PPG IND OHIO INC
20 patentsUS6844504B2Jan 18, 2005
Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
PPG IND OHIO INC28 citations92
US6590049B1Jul 8, 2003
Multi-functional initiators for atom transfer radical (Co)polymerization
PPG IND OHIO INC23 citations92
US7803415B2Sep 28, 2010
Methods for coating food cans
PPG IND OHIO INC20 citations91
US7745508B2Jun 29, 2010
Compositions and methods for coating food cans
PPG IND OHIO INC18 citations91
US7000313B2Feb 21, 2006
Process for fabricating circuit assemblies using electrodepositable dielectric coating compositions
PPG IND OHIO INC12 citations84
US7690103B2Apr 6, 2010
Method of forming a printed circuit board with improved via design
PPG IND OHIO INC6 citations74
US7002081B2Feb 21, 2006
Single or multi-layer printed circuit board with recessed or extended breakaway tabs and method of manufacture thereof
PPG IND OHIO INC8 citations74
US6951707B2Oct 4, 2005
Process for creating vias for circuit assemblies
PPG IND OHIO INC10 citations74
US6824959B2Nov 30, 2004
Process for creating holes in polymeric substrates
PPG IND OHIO INC8 citations74
US6326420B1Dec 4, 2001
Pigment dispersions containing dispersants prepared by controlled radical polymerization
PPG IND OHIO INC12 citations74
US6713587B2Mar 30, 2004
Electrodepositable dielectric coating compositions and methods related thereto
PPG IND OHIO INC11 citations73
US6671950B2Jan 6, 2004
Multi-layer circuit assembly and process for preparing the same
PPG IND OHIO INC7 citations73
US8008188B2Aug 30, 2011
Method of forming solid blind vias through the dielectric coating on high density interconnect substrate materials
PPG IND OHIO INC2 citations63
US7743494B2Jun 29, 2010
Process of fabricating a circuit board
PPG IND OHIO INC4 citations63
US7679001B2Mar 16, 2010
Circuit board and method of manufacture thereof
PPG IND OHIO INC2 citations63
US7159308B2Jan 9, 2007
Method of making a circuit board
PPG IND OHIO INC1 citations63
US7666945B2Feb 23, 2010
Non-gelled curable compositions containing imide functional compositions
PPG IND OHIO INC2 citations62
US7294683B2Nov 13, 2007
Non-gelled curable compositions containing imide functional compounds
PPG IND OHIO INC2 citations62
US7485812B2Feb 3, 2009
Single or multi-layer printed circuit board with improved via design
PPG IND OHIO INC4 citations61
US7228623B2Jun 12, 2007
Process for fabricating a multi layer circuit assembly
PPG IND OHIO INC0 citations52
OLSON KEVIN C
4 patentsUS8409982B2Apr 2, 2013
Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials
OLSON KEVIN C0 citations50
US8141245B2Mar 27, 2012
Method of forming a circuit board with improved via design
OLSON KEVIN C1 citations49
US8598467B2Dec 3, 2013
Multi-layer circuit assembly and process for preparing the same
OLSON KEVIN C0 citations42
US8065795B2Nov 29, 2011
Multi-layer circuit assembly and process for preparing the same
OLSON KEVIN C0 citations42