Inventor
MATSUDA YUICHI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “MATSUDA YUICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SHINKO ELECTRIC IND CO
13 patentsUS6418615B1Jul 16, 2002
Method of making multilayered substrate for semiconductor device
SHINKO ELECTRIC IND CO164 citations99
US6441314B2Aug 27, 2002
Multilayered substrate for semiconductor device
SHINKO ELECTRIC IND CO80 citations98
US6931724B2Aug 23, 2005
Insulated multilayered substrate having connecting leads for mounting a semiconductor element thereon
SHINKO ELECTRIC IND CO35 citations92
US6828669B2Dec 7, 2004
Interconnection substrate having metal columns covered by a resin film, and manufacturing method thereof
SHINKO ELECTRIC IND CO33 citations92
US7763809B2Jul 27, 2010
Multilayered substrate for semiconductor device and method of manufacturing same
SHINKO ELECTRIC IND CO5 citations74
US8362369B2Jan 29, 2013
Wiring board
SHINKO ELECTRIC IND CO0 citations42
US9488677B2Nov 8, 2016
Probe card having a wiring substrate
SHINKO ELECTRIC IND CO0 citations41
US9476913B2Oct 25, 2016
Probe card
SHINKO ELECTRIC IND CO0 citations41
US9470718B2Oct 18, 2016
Probe card
SHINKO ELECTRIC IND CO0 citations41
US9459289B2Oct 4, 2016
Probe card and method for manufacturing probe card
SHINKO ELECTRIC IND CO0 citations41
US9373587B2Jun 21, 2016
Stacked electronic device
SHINKO ELECTRIC IND CO0 citations41
US9204544B2Dec 1, 2015
Wiring substrate and method of manufacturing the same
SHINKO ELECTRIC IND CO0 citations41
US9202781B2Dec 1, 2015
Wiring substrate, method for manufacturing wiring substrate, and semiconductor package
SHINKO ELECTRIC IND CO0 citations34
HORIUCHI MICHIO
7 patentsUS9460983B2Oct 4, 2016
Joining structure using thermal interface material
HORIUCHI MICHIO8 citations83
US8138609B2Mar 20, 2012
Semiconductor device and method of manufacturing semiconductor device
HORIUCHI MICHIO16 citations83
US9006586B2Apr 14, 2015
Wiring substrate, its manufacturing method, and semiconductor device
HORIUCHI MICHIO2 citations62
US8664764B2Mar 4, 2014
Semiconductor device including a core substrate and a semiconductor element
HORIUCHI MICHIO2 citations62
US8324513B2Dec 4, 2012
Wiring substrate and semiconductor apparatus including the wiring substrate
HORIUCHI MICHIO5 citations62
US8242612B2Aug 14, 2012
Wiring board having piercing linear conductors and semiconductor device using the same
HORIUCHI MICHIO3 citations61
US8638542B2Jan 28, 2014
Capacitor containing a large number of filamentous conductors and method of manufacturing the same
HORIUCHI MICHIO0 citations40
FUJITSU LTD
4 patentsUS5636206AJun 3, 1997
System for achieving alarm masking processing
FUJITSU LTD39 citations92
US9535743B2Jan 3, 2017
Data processing control method, computer-readable recording medium, and data processing control device for performing a Mapreduce process
FUJITSU LTD2 citations68
US7725548B2May 25, 2010
Computer-readable recording medium recording communication programs, communication method and communication apparatus
FUJITSU LTD6 citations61
US9921874B2Mar 20, 2018
Storage medium, information processing device, and information processing method
FUJITSU LTD0 citations41
MITSUI CHEMICALS INC
2 patentsPRIME POLYMER CO LTD
2 patentsMATSUDA YUICHI
2 patentsUS8832496B2Sep 9, 2014
Information managing computer product, apparatus, and method
MATSUDA YUICHI2 citations58
US9344347B2May 17, 2016
Delay time measuring apparatus, computer readable record medium on which delay time measuring program is recorded, and delay time measuring method
MATSUDA YUICHI0 citations37