Inventor
YANG HSUEH-AN
TW19 patents
⚠️ This page may combine multiple inventors who share the name “YANG HSUEH-AN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
6 patentsUS7681779B2Mar 23, 2010
Method for manufacturing electric connections in wafer
ADVANCED SEMICONDUCTOR ENG25 citations92
US7706149B2Apr 27, 2010
Micro-electro-mechanical-system package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG38 citations90
US7945062B2May 17, 2011
Microelectromechanical microphone packaging system
ADVANCED SEMICONDUCTOR ENG3 citations62
US7651888B2Jan 26, 2010
Wafer lever fixture and method for packaging micro-electro-mechanical-system devices
ADVANCED SEMICONDUCTOR ENG3 citations62
US7501342B2Mar 10, 2009
Device having high aspect-ratio via structure in low-dielectric material and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG2 citations62
US7863181B2Jan 4, 2011
Method for manufacturing a device having a high aspect ratio via
ADVANCED SEMICONDUCTOR ENG0 citations41
TAIWAN SEMICONDUCTOR MFG
4 patentsUS9240348B2Jan 19, 2016
Method of making a semiconductor device package
TAIWAN SEMICONDUCTOR MFG1 citations62
US8633554B2Jan 21, 2014
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG3 citations62
US8368152B2Feb 5, 2013
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG4 citations62
US9056766B2Jun 16, 2015
Method of forming a bond ring for a first and second substrate
TAIWAN SEMICONDUCTOR MFG0 citations52
YANG HSUEH-AN
3 patentsUS8836116B2Sep 16, 2014
Wafer level packaging of micro-electro-mechanical systems (MEMS) and complementary metal-oxide-semiconductor (CMOS) substrates
YANG HSUEH-AN8 citations82
US8277667B2Oct 2, 2012
Magnetic element and manufacturing method therefor
YANG HSUEH-AN9 citations81
US8263493B2Sep 11, 2012
Silicon chip having through via and method for making the same
YANG HSUEH-AN0 citations39