P

Inventor

KUMADA TERUHIKO

JP21 patents
⚠️ This page may combine multiple inventors who share the name “KUMADA TERUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

9 patents
US6924240B2Aug 2, 2005

Low dielectric constant material, insulating film comprising the low dielectric constant material, and semiconductor device

MITSUBISHI ELECTRIC CORP24 citations92
US5100762AMar 31, 1992

Radiation-sensitive polymer and radiation-sensitive composition containing the same

MITSUBISHI ELECTRIC CORP22 citations91
US5204218AApr 20, 1993

Photosensitive resin composition

MITSUBISHI ELECTRIC CORP15 citations72
US6511792B2Jan 28, 2003

Developing process, process for forming pattern and process for preparing semiconductor device using same

MITSUBISHI ELECTRIC CORP7 citations66
US7030007B2Apr 18, 2006

Via-filling material and process for fabricating semiconductor integrated circuit using the material

MITSUBISHI ELECTRIC CORP3 citations61
US5981146ANov 9, 1999

Resist coating film

MITSUBISHI ELECTRIC CORP6 citations59
US8043678B2Oct 25, 2011

Radome and method of producing the same

MITSUBISHI ELECTRIC CORP3 citations56
US7824784B2Nov 2, 2010

Composition for low dielectric material, low dielectric material and method for production thereof

MITSUBISHI ELECTRIC CORP0 citations41
US6984473B2Jan 10, 2006

Method of patterning a mask blank

MITSUBISHI ELECTRIC CORP0 citations39

KUMADA TERUHIKO

2 patents
US8846148B2Sep 30, 2014

Composition for chemical vapor deposition film-formation and method for production of low dielectric constant film

KUMADA TERUHIKO4 citations69
US8404314B2Mar 26, 2013

Plasma CVD apparatus, method for forming thin film and semiconductor device

KUMADA TERUHIKO1 citations49

SAMEJIMA SOHEI

2 patents
US8134085B2Mar 13, 2012

Printed interconnection board having a core including carbon fiber reinforced plastic

SAMEJIMA SOHEI4 citations60
US9313903B2Apr 12, 2016

Method of manufacturing printed wiring board

SAMEJIMA SOHEI1 citations49

MORIOKA REIJI

1 patent
US8448697B2May 28, 2013

Coating composition, heat exchanger, and air-conditioner

MORIOKA REIJI6 citations71

RENESAS TECH CORP

1 patent
US7671473B2Mar 2, 2010

Semiconductor device and method of fabricating the same

RENESAS TECH CORP2 citations62

YOSHIDA YASUHIRO

1 patent
US8801850B2Aug 12, 2014

Coating composition, and its production, heat exchanger and air conditioner

YOSHIDA YASUHIRO3 citations60

KAFUKU HIDETAKA

1 patent
US8288294B2Oct 16, 2012

Insulating film for semiconductor device, process and apparatus for producing insulating film for semiconductor device, semiconductor device, and process for producing the semiconductor device

KAFUKU HIDETAKA4 citations55

RENESAS ELECTRONICS CORP

1 patent
US7981790B2Jul 19, 2011

Semiconductor device and method of fabricating the same

RENESAS ELECTRONICS CORP0 citations52

YAMAMOTO YOSHINORI

1 patent
US9481802B2Nov 1, 2016

Coating composition, coating method, air conditioner, ventilation fan, and electrical equipment

YAMAMOTO YOSHINORI0 citations51

SAMEJIMA SOUHEI

1 patent
US8148647B2Apr 3, 2012

Printed circuit board and method of manufacturing the same

SAMEJIMA SOUHEI2 citations51

NOBUTOKI HIDEHARU

1 patent
US8674046B2Mar 18, 2014

Source material for preparing low dielectric constant material

NOBUTOKI HIDEHARU0 citations45