Inventor

FUJISHIMA HIROYUKI

JP4 patents

⚠️ This page may combine multiple inventors who share the name “FUJISHIMA HIROYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

POWERTECH TECHNOLOGY INC

2 patents

US12094809B2Sep 17, 2024

Chip-middle type fan-out panel-level package and packaging method thereof

POWERTECH TECHNOLOGY INC0 citations50

US9553036B1Jan 24, 2017

Semiconductor package and manufacturing method thereof

POWERTECH TECHNOLOGY INC1 citations49

TEIJIN LTD

1 patent

US6136444AOct 24, 2000

Transparent conductive sheet

TEIJIN LTD69 citations94

FUJISHIMA HIROYUKI

1 patent

US8274143B2Sep 25, 2012

Semiconductor device, method of forming the same, and electronic device

FUJISHIMA HIROYUKI22 citations86