Inventor
LETTERMAN JR JAMES P
US28 patents
⚠️ This page may combine multiple inventors who share the name “LETTERMAN JR JAMES P”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMICONDUCTOR COMPONENTS IND LLC
12 patentsUS10269609B2Apr 23, 2019
Wafer level flat no-lead semiconductor packages and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC4 citations83
US10304798B2May 28, 2019
Semiconductor packages with leadframes and related methods
SEMICONDUCTOR COMPONENTS IND LLC4 citations82
US9899349B2Feb 20, 2018
Semiconductor packages and related methods
SEMICONDUCTOR COMPONENTS IND LLC6 citations82
US10163766B2Dec 25, 2018
Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
SEMICONDUCTOR COMPONENTS IND LLC3 citations72
US10103072B2Oct 16, 2018
Damaging components with defective electrical couplings
SEMICONDUCTOR COMPONENTS IND LLC2 citations72
US11145581B2Oct 12, 2021
Methods of forming leadless semiconductor packages with plated leadframes and wettable flanks
SEMICONDUCTOR COMPONENTS IND LLC0 citations62
US11049843B2Jun 29, 2021
Semiconductor packages
SEMICONDUCTOR COMPONENTS IND LLC0 citations61
US10770332B2Sep 8, 2020
Wafer level flat no-lead semiconductor packages and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US10770333B2Sep 8, 2020
Wafer level flat no-lead semiconductor packages and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US10707111B2Jul 7, 2020
Wafer level flat no-lead semiconductor packages and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US10529632B2Jan 7, 2020
Damaging components with defective electrical couplings
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
US9892952B2Feb 13, 2018
Wafer level flat no-lead semiconductor packages and methods of manufacture
SEMICONDUCTOR COMPONENTS IND LLC0 citations51
SEMICONDUCTOR COMPONENTS IND
10 patentsUS6164523ADec 26, 2000
Electronic component and method of manufacture
SEMICONDUCTOR COMPONENTS IND137 citations99
US6081031AJun 27, 2000
Semiconductor package consisting of multiple conductive layers
SEMICONDUCTOR COMPONENTS IND27 citations92
US6768186B2Jul 27, 2004
Semiconductor device and laminated leadframe package
SEMICONDUCTOR COMPONENTS IND20 citations88
US7439100B2Oct 21, 2008
Encapsulated chip scale package having flip-chip on lead frame structure and method
SEMICONDUCTOR COMPONENTS IND13 citations81
US7656048B2Feb 2, 2010
Encapsulated chip scale package having flip-chip on lead frame structure
SEMICONDUCTOR COMPONENTS IND7 citations71
US7901990B2Mar 8, 2011
Method of forming a molded array package device having an exposed tab and structure
SEMICONDUCTOR COMPONENTS IND5 citations62
US7638863B2Dec 29, 2009
Semiconductor package and method therefor
SEMICONDUCTOR COMPONENTS IND3 citations62
US7602054B2Oct 13, 2009
Method of forming a molded array package device having an exposed tab and structure
SEMICONDUCTOR COMPONENTS IND2 citations62
US7825505B2Nov 2, 2010
Semiconductor package and method therefor
SEMICONDUCTOR COMPONENTS IND0 citations52
US7109064B2Sep 19, 2006
Method of forming a semiconductor package and leadframe therefor
SEMICONDUCTOR COMPONENTS IND0 citations40
MOTOROLA INC
3 patentsUS5886400AMar 23, 1999
Semiconductor device having an insulating layer and method for making
MOTOROLA INC26 citations91
US5785791AJul 28, 1998
Method of manufacturing semiconductor component
MOTOROLA INC19 citations85
US5309027AMay 3, 1994
Encapsulated semiconductor package having protectant circular insulators
MOTOROLA INC16 citations74