Inventor

YASUDA YUSUKE

JP11 patents

⚠️ This page may combine multiple inventors who share the name “YASUDA YUSUKE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI LTD

2 patents

US7955411B2Jun 7, 2011

Low temperature bonding material comprising metal particles and bonding method

HITACHI LTD13 citations84

US8008772B2Aug 30, 2011

Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof

HITACHI LTD1 citations51

YASUDA YUSUKE

2 patents

US8821768B2Sep 2, 2014

Bonding method and bonding material using metal particle

YASUDA YUSUKE5 citations71

US8821676B2Sep 2, 2014

Low temperature bonding material comprising coated metal nanoparticles, and bonding method

YASUDA YUSUKE3 citations60

MORITA TOSHIAKI

2 patents

US8513534B2Aug 20, 2013

Semiconductor device and bonding material

MORITA TOSHIAKI6 citations70

US8592996B2Nov 26, 2013

Semiconductor device and method of manufacturing the same

MORITA TOSHIAKI3 citations60

NIDEC CORP

2 patents

US11159073B2Oct 26, 2021

Motor including sealing structure

NIDEC CORP1 citations53

US10128721B2Nov 13, 2018

Motor

NIDEC CORP0 citations33

RENESAS ELECTRONICS CORP

2 patents

US10075123B2Sep 11, 2018

Semiconductor device, motor control system, and control method for semiconductor device

RENESAS ELECTRONICS CORP1 citations50

US10819266B2Oct 27, 2020

Motor driving system and motor driving method

RENESAS ELECTRONICS CORP0 citations39

IDE EIICHI

1 patent

US8400777B2Mar 19, 2013

Electronic member, electronic part and manufacturing method therefor

IDE EIICHI6 citations71