Inventor

GOH WEI ZHEN

SG2 patents

Patents

2 patents

US8907465B2Dec 9, 2014

Methods and devices for packaging integrated circuits

ST MICROELECTRONICS PTE LTD0 citations45

US9679870B2Jun 13, 2017

Integrated circuit device with shaped leads and method of forming the device

ST MICROELECTRONICS PTE LTD0 citations36