Inventor
MAHNKOPF REINHARD
DE28 patents
⚠️ This page may combine multiple inventors who share the name “MAHNKOPF REINHARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL IP CORP
11 patentsUS9663353B2May 30, 2017
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
INTEL IP CORP29 citations94
US9550670B2Jan 24, 2017
Stress buffer layer for integrated microelectromechanical systems (MEMS)
INTEL IP CORP2 citations73
US9209143B2Dec 8, 2015
Die edge side connection
INTEL IP CORP5 citations72
US11410908B2Aug 9, 2022
Integrated circuit devices with front-end metal structures
INTEL IP CORP0 citations62
US11145577B2Oct 12, 2021
Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus
INTEL IP CORP0 citations62
US11037855B2Jun 15, 2021
Contoured-on-heat-sink, wrapped printed wiring boards for system-in-package apparatus
INTEL IP CORP0 citations62
US11018114B2May 25, 2021
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
INTEL IP CORP0 citations61
US10301176B2May 28, 2019
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
INTEL IP CORP0 citations52
US10150668B2Dec 11, 2018
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
INTEL IP CORP0 citations52
US10141265B2Nov 27, 2018
Bent-bridge semiconductive apparatus
INTEL IP CORP0 citations51
US10535578B2Jan 14, 2020
Semiconductor devices, and a method for forming a semiconductor device
INTEL IP CORP0 citations41
INTEL CORP
6 patentsUS9888577B2Feb 6, 2018
Passive electrical devices with a polymer carrier
INTEL CORP3 citations73
US10403602B2Sep 3, 2019
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
INTEL CORP2 citations72
US9564400B2Feb 7, 2017
Methods of forming stacked microelectronic dice embedded in a microelectronic substrate
INTEL CORP4 citations72
US11456116B2Sep 27, 2022
Magnetic coils in locally thinned silicon bridges and methods of assembling same
INTEL CORP0 citations62
US9373588B2Jun 21, 2016
Stacked microelectronic dice embedded in a microelectronic substrate
INTEL CORP2 citations62
US11764187B2Sep 19, 2023
Semiconductor packages, and methods for forming semiconductor packages
INTEL CORP0 citations52