Inventor

ALBERS SVEN

DE46 patents

⚠️ This page may combine multiple inventors who share the name “ALBERS SVEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ALBERS SVEN

INTEL IP CORP

System-in-package devices and methods for forming system-in-package devices

Electronic components having three-dimensional capacitors in a metallization stack

Electrical device and a method for forming an electrical device

Integrated circuit packages including an optical redistribution layer

Flow diversion devices

Redistribution layer lines

Die edge side connection

Semiconductor package having a variable redistribution layer thickness

Semiconductor package having a variable redistribution layer thickness

Integrated circuit package configurations to reduce stiffness

Wafer level package structure with internal conductive layer

Vertical wire connections for integrated circuit package

Semiconductor die package with more than one hanging die

Integrated circuit packages including an optical redistribution layer

Integrated circuit package configurations to reduce stiffness

Electronic package with coil formed on core

Integrated circuit package configurations to reduce stiffness

Cooler for semiconductor devices

Microelectronic package with illuminated backside exterior

Flexible band wearable electronic device

INTEL CORP

Microelectronic package having a passive microelectronic device disposed within a package body

Three dimensional structures within mold compound

Magnetic contacts

Package stacking using chip to wafer bonding

Package stacking using chip to wafer bonding

Embedded die flip-chip package assembly

Passive electrical devices with a polymer carrier

Methods of forming stacked microelectronic dice embedded in a microelectronic substrate

Contact pads for integrated circuit packages

Wafer level package structure with internal conductive layer

Stacked microelectronic dice embedded in a microelectronic substrate

Magnetic contacts

Magnetic contacts

Microelectronic package having a passive microelectronic device disposed within a package body

Flexibly-wrapped integrated circuit die

Wearable computing device

MEYER THORSTEN

Stacked fan-out semiconductor chip

Semiconductor device with chip having low-k-layers

INTEL DEUTSCHLAND GMBH

Semiconductor devices

Chip package-in-package

INTEL MOBILE COMM GMBH

Chip package-in-package and method thereof

Chip arrangements

INFINEON TECHNOLOGIES AG

ESD protection apparatus and electrical circuit including same

Bonding pad for contacting a device

ALBERS SVEN

ESD protection apparatus and electrical circuit including same

Device for implementing a dry electrical connection of a motor vehicle lock