Inventor
AUGUSTIN ANDREAS
DE29 patents
⚠️ This page may combine multiple inventors who share the name “AUGUSTIN ANDREAS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS11784143B2Oct 10, 2023
Single metal cavity antenna in package connected to an integrated transceiver front-end
INTEL CORP2 citations72
US11646498B2May 9, 2023
Package integrated cavity resonator antenna
INTEL CORP2 citations72
US10403602B2Sep 3, 2019
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
INTEL CORP2 citations72
US12191571B2Jan 7, 2025
Antenna with graded dielectirc and method of making the same
INTEL CORP0 citations62
US11521793B2Dec 6, 2022
Resonant LC tank package and method of manufacture
INTEL CORP0 citations62
US11456116B2Sep 27, 2022
Magnetic coils in locally thinned silicon bridges and methods of assembling same
INTEL CORP0 citations62
US11127813B2Sep 21, 2021
Semiconductor inductors
INTEL CORP0 citations62
US11764187B2Sep 19, 2023
Semiconductor packages, and methods for forming semiconductor packages
INTEL CORP0 citations52
US11374323B2Jun 28, 2022
Patch antennas stitched to systems in packages and methods of assembling same
INTEL CORP0 citations51
US10560125B2Feb 11, 2020
Techniques for data compression
INTEL CORP0 citations51
INTEL IP CORP
9 patentsUS9663353B2May 30, 2017
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
INTEL IP CORP29 citations94
US9550670B2Jan 24, 2017
Stress buffer layer for integrated microelectromechanical systems (MEMS)
INTEL IP CORP2 citations73
US11031699B2Jun 8, 2021
Antenna with graded dielectirc and method of making the same
INTEL IP CORP4 citations72
US10896780B2Jan 19, 2021
Resonant LC tank package and method of manufacture
INTEL IP CORP2 citations72
US10867934B2Dec 15, 2020
Component magnetic shielding for microelectronic devices
INTEL IP CORP4 citations71
US11018114B2May 25, 2021
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory
INTEL IP CORP0 citations61
US10301176B2May 28, 2019
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
INTEL IP CORP0 citations52
US10150668B2Dec 11, 2018
Microelectromechanical system (MEMS) on application specific integrated circuit (ASIC)
INTEL IP CORP0 citations52
US10122420B2Nov 6, 2018
Wireless in-chip and chip to chip communication
INTEL IP CORP0 citations50
INTEL MOBILE COMM GMBH
2 patentsPHILIPS CORP
2 patentsUS6360978B1Mar 26, 2002
Recording and/or reproducing device having a take-up reel and having a tape pull-out assembly which can be positioned radially with respect to the take-up reel
PHILIPS CORP9 citations73
US6330983B1Dec 18, 2001
Recording and/or reproducing device having a tape pull-out element and a coupling element and having guide means for these two parts
PHILIPS CORP9 citations73