Inventor

KUO YING-HAO

TW87 patents

⚠️ This page may combine multiple inventors who share the name “KUO YING-HAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KUO YING-HAO

TAIWAN SEMICONDUCTOR MFG CO LTD

Optical bench on substrate and method of making the same

Method of making a metal grating in a waveguide and device formed

Thermally conductive structure for heat dissipation in semiconductor packages

Etchant and etching process

Semiconductor device and method of manufacturing

Package and method for integration of heterogeneous integrated circuits

Bio-chip package with waveguide integrated spectrometer

Thermally conductive structure for heat dissipation in semiconductor packages

Method of making a metal grating in a waveguide and device formed

Package and method for integration of heterogeneous integrated circuits

Package structure and methods of forming same

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Etchant and etching process for substrate of a semiconductor device

Package and method for integration of heterogeneous integrated circuits

Package structure and methods of forming same

Method for forming semiconductor package using carbon nano material in molding compound

Bio-chip package with waveguide integrated spectrometer

Electro-optic modulator device, optical device and method of making an optical device

Method of making a metal grating in a waveguide and device formed

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Vacuum carrier module, method of using and process of making the same

Backside-illuminated photodetector structure and method of making the same

Bio-chip package with waveguide integrated spectrometer

Semiconductor device and method of manufacturing

Waveguide structure and method for fabricating the same

Apparatus and method of forming laser chip package with waveguide for light coupling

Light coupling device and methods of forming same

Apparatus and package structure of optical chip

Integrated metal grating

Thermally conductive molding compound structure for heat dissipation in semiconductor packages

Method for forming semiconductor package using carbon nano material in molding compound

Bio-chip package with waveguide integrated spectrometer

Thermally conductive structure for heat dissipation in semiconductor packages

Semiconductor arrangement and formation thereof

Optical bench, method of making and method of using

Temporary bonding scheme

Semiconductor device and method of manufacturing

Adhesion promoter apparatus and method

TAIWAN SEMICONDUCTOR MFG

Package structure and methods of forming same

Package structure and methods of forming same

Light coupling device and methods of forming same

Light coupling formation in a waveguide layer

Apparatus and method for chip placement and molding

Optical element structure and optical element fabricating process for the same

Self-alignment due to wettability difference of an interface

Waveguide structure

Optical spectroscopy device, process of making the same, and method of using the same

Manufacture including substrate and package structure of optical chip

INTEL CORP

Semiconductor Raman ring amplifier

Semiconductor raman ring amplifier