Inventor

LEE WANG-JU

TW5 patents

⚠️ This page may combine multiple inventors who share the name “LEE WANG-JU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

3 patents

US8829667B2Sep 9, 2014

Electronic devices including EMI shield structures for semiconductor packages and methods of fabricating the same

SAMSUNG ELECTRONICS CO LTD24 citations91

US7692314B2Apr 6, 2010

Wafer level chip scale package and method for manufacturing the same

SAMSUNG ELECTRONICS CO LTD20 citations90

US7884487B2Feb 8, 2011

Rotation joint and semiconductor device having the same

SAMSUNG ELECTRONICS CO LTD3 citations60

FIRST DOME CORP

1 patent

US10364837B2Jul 30, 2019

Dual-shaft synchronous transmission device and transmission module

FIRST DOME CORP4 citations67

TSENG CHIEN-CHUNG

1 patent

US9152636B2Oct 6, 2015

Content protection system in storage media and method of the same

TSENG CHIEN-CHUNG2 citations56