Inventor
PANTH SHREEPAD AMAR
US3 patents
Patents
3 patentsUS9123721B2Sep 1, 2015
Placement of monolithic inter-tier vias (MIVs) within monolithic three dimensional (3D) integrated circuits (ICs) (3DICs) using clustering to increase usable whitespace
QUALCOMM INC5 citations71
US10510651B2Dec 17, 2019
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
QUALCOMM INC1 citations69
US11004780B2May 11, 2021
Hard macro having blockage sites, integrated circuit including same and method of routing through a hard macro
QUALCOMM INC0 citations58