Inventor

Wang zi qi

CN3 patents

Patents

3 patents

US10340246B1Jul 2, 2019

Wire ball bonding in semiconductor devices

TEXAS INSTRUMENTS INC2 citations64

US12538833B2Jan 27, 2026

Ball bonding for semiconductor devices

TEXAS INSTRUMENTS INC0 citations53

US10692835B2Jun 23, 2020

Ball bond attachment for a semiconductor die

TEXAS INSTRUMENTS INC1 citations53