Inventor
Kang Xiao Lin
CN4 patents
Patents
4 patentsUS12283559B2Apr 22, 2025
Copper wire bond on gold bump on semiconductor die bond pad
TEXAS INSTRUMENTS INC0 citations56
US11515275B2Nov 29, 2022
Copper wire bond on gold bump on semiconductor die bond pad
TEXAS INSTRUMENTS INC0 citations56
US12538833B2Jan 27, 2026
Ball bonding for semiconductor devices
TEXAS INSTRUMENTS INC0 citations53
US10692835B2Jun 23, 2020
Ball bond attachment for a semiconductor die
TEXAS INSTRUMENTS INC1 citations53