Inventor
HORITA HIDEKI
JP18 patents
⚠️ This page may combine multiple inventors who share the name “HORITA HIDEKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
9 patentsUS7779785B2Aug 24, 2010
Production method for semiconductor device and substrate processing apparatus
HITACHI INT ELECTRIC INC21 citations92
US8039404B2Oct 18, 2011
Production method for semiconductor device
HITACHI INT ELECTRIC INC9 citations84
US9552980B2Jan 24, 2017
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations73
US9401272B2Jul 26, 2016
Cleaning method, method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC3 citations73
US11041240B2Jun 22, 2021
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
HITACHI INT ELECTRIC INC2 citations72
US10513775B2Dec 24, 2019
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC4 citations72
US10513774B2Dec 24, 2019
Substrate processing apparatus and guide portion
HITACHI INT ELECTRIC INC1 citations62
US9905413B2Feb 27, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations51
US9934960B2Apr 3, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations50
KOKUSAI ELECTRIC CORP
7 patentsUS11236743B2Feb 1, 2022
Substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP3 citations71
US12381079B2Aug 5, 2025
Method of manufacturing semiconductor device, substrate processing apparatus, recording medium and method of processing substrate
KOKUSAI ELECTRIC CORP0 citations60
US12341000B2Jun 24, 2025
Substrate processing apparatus and recording medium
KOKUSAI ELECTRIC CORP0 citations60
US11587788B2Feb 21, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations60
US10714336B2Jul 14, 2020
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations51
US11066744B2Jul 20, 2021
Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations48
US12563981B2Feb 24, 2026
Method of processing substrate, substrate processing apparatus, recording medium, and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations41