Inventor
BLACK STEPHEN H
US34 patents
⚠️ This page may combine multiple inventors who share the name “BLACK STEPHEN H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
21 patentsUS6885002B1Apr 26, 2005
IRFPA ROIC with dual TDM reset integrators and sub-frame averaging functions per unit cell
RAYTHEON CO33 citations91
US9570321B1Feb 14, 2017
Use of an external getter to reduce package pressure
RAYTHEON CO6 citations84
US6133596AOct 17, 2000
Near complete charge transfer device
RAYTHEON CO16 citations84
US9093444B2Jul 28, 2015
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO4 citations83
US8736045B1May 27, 2014
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO8 citations82
US8044355B2Oct 25, 2011
System and method for viewing an area using an optical system positioned inside of a dewar
RAYTHEON CO9 citations82
US6288387B1Sep 11, 2001
Apparatus and method for performing optical signal intensity correction in electro-optical sensor arrays
RAYTHEON CO12 citations72
US9227839B2Jan 5, 2016
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
RAYTHEON CO2 citations62
US9334154B2May 10, 2016
Hermetically sealed package having stress reducing layer
RAYTHEON CO2 citations60
US9865519B2Jan 9, 2018
Use of an external getter to reduce package pressure
RAYTHEON CO0 citations52
US10315918B2Jun 11, 2019
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO0 citations51
US10262913B2Apr 16, 2019
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9966320B2May 8, 2018
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9520332B2Dec 13, 2016
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9427776B2Aug 30, 2016
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO1 citations51
US9196556B2Nov 24, 2015
Getter structure and method for forming such structure
RAYTHEON CO0 citations50
US9187312B2Nov 17, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9174836B2Nov 3, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9708181B2Jul 18, 2017
Hermetically sealed package having stress reducing layer
RAYTHEON CO0 citations49
US9407820B2Aug 2, 2016
Method and apparatus for inhibiting diversion of devices using an embedded accelerometer
RAYTHEON CO1 citations48
US9105800B2Aug 11, 2015
Method of forming deposited patterns on a surface
RAYTHEON CO0 citations39
BLACK STEPHEN H
5 patentsUS8608894B2Dec 17, 2013
Wafer level packaged focal plane array
BLACK STEPHEN H5 citations71
US8511823B2Aug 20, 2013
Imaging system
BLACK STEPHEN H5 citations67
US9022584B2May 5, 2015
Protecting an optical surface
BLACK STEPHEN H2 citations60
US8653467B2Feb 18, 2014
Multichip packaging for imaging system
BLACK STEPHEN H1 citations50
US8586926B2Nov 19, 2013
Antenna-coupled antenna arrays
BLACK STEPHEN H1 citations47