Inventor
KENNEDY ADAM M
US38 patents
⚠️ This page may combine multiple inventors who share the name “KENNEDY ADAM M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
RAYTHEON CO
31 patentsUS5921461AJul 13, 1999
Vacuum package having vacuum-deposited local getter and its preparation
RAYTHEON CO87 citations92
US6077046AJun 20, 2000
Getter assembly having porous metallic support and its use in a vacuum apparatus
RAYTHEON CO21 citations90
US6417514B1Jul 9, 2002
Sensor/support system having a stabilization structure affixed to a side of a platform oppositely disposed from a sensor assembly
RAYTHEON CO30 citations87
US9570321B1Feb 14, 2017
Use of an external getter to reduce package pressure
RAYTHEON CO6 citations84
US9093444B2Jul 28, 2015
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO4 citations83
US7105821B1Sep 12, 2006
Thermally stabilized radiation detector utilizing temperature controlled radiation filter
RAYTHEON CO20 citations83
US8736045B1May 27, 2014
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO8 citations82
US7084010B1Aug 1, 2006
Integrated package design and method for a radiation sensing device
RAYTHEON CO13 citations79
US6326611B1Dec 4, 2001
Integrated multiple sensor package
RAYTHEON CO14 citations74
US6107216AAug 22, 2000
Bonded structure with high-conductivity bonding element
RAYTHEON CO13 citations71
US6649913B1Nov 18, 2003
Method and apparatus providing focal plane array active thermal control elements
RAYTHEON CO12 citations70
US10451487B1Oct 22, 2019
Per-pixel dark reference bolometer
RAYTHEON CO5 citations65
US9227839B2Jan 5, 2016
Wafer level packaged infrared (IR) focal plane array (FPA) with evanescent wave coupling
RAYTHEON CO2 citations62
US9334154B2May 10, 2016
Hermetically sealed package having stress reducing layer
RAYTHEON CO2 citations60
US9865519B2Jan 9, 2018
Use of an external getter to reduce package pressure
RAYTHEON CO0 citations52
US10315918B2Jun 11, 2019
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO0 citations51
US10262913B2Apr 16, 2019
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9966320B2May 8, 2018
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9520332B2Dec 13, 2016
Wafer level package solder barrier used as vacuum getter
RAYTHEON CO0 citations51
US9427776B2Aug 30, 2016
Method of stress relief in anti-reflective coated cap wafers for wafer level packaged infrared focal plane arrays
RAYTHEON CO1 citations51
US10267997B2Apr 23, 2019
Infrared scene projector with per-pixel spectral and polarisation capability
RAYTHEON CO0 citations50
US9969610B2May 15, 2018
Wafer level MEMS package including dual seal ring
RAYTHEON CO1 citations50
US9771258B2Sep 26, 2017
Wafer level MEMS package including dual seal ring
RAYTHEON CO0 citations50
US9196556B2Nov 24, 2015
Getter structure and method for forming such structure
RAYTHEON CO0 citations50
US9187312B2Nov 17, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US9174836B2Nov 3, 2015
Integrated bondline spacers for wafer level packaged circuit devices
RAYTHEON CO0 citations50
US11750945B2Sep 5, 2023
Imager with integrated asynchronous laser pulse detection having a signal component along a second electrical pathway passes through an ALPD readout integrated circuit to an imaging readout integrated circuit
RAYTHEON CO0 citations49
US9708181B2Jul 18, 2017
Hermetically sealed package having stress reducing layer
RAYTHEON CO0 citations49
US12261186B2Mar 25, 2025
Mosaic focal plane array
RAYTHEON CO0 citations48
US11284025B2Mar 22, 2022
Digital pixel having high sensitivity and dynamic range
RAYTHEON CO0 citations48
US9105800B2Aug 11, 2015
Method of forming deposited patterns on a surface
RAYTHEON CO0 citations39