Inventor
CHAN HSUN-WEI
TW29 patents
⚠️ This page may combine multiple inventors who share the name “CHAN HSUN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
ADVANCED SEMICONDUCTOR ENG
26 patentsUS10396783B2Aug 27, 2019
Optical module, manufacturing method thereof and electronic apparatus
ADVANCED SEMICONDUCTOR ENG10 citations83
US11276806B2Mar 15, 2022
Semiconductor device package and method for manufacturing the same
ADVANCED SEMICONDUCTOR ENG4 citations71
US10436635B2Oct 8, 2019
Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same
ADVANCED SEMICONDUCTOR ENG2 citations70
US12352602B2Jul 8, 2025
Optical module and method of making the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11835363B2Dec 5, 2023
Optical module and method of making the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US11588081B2Feb 21, 2023
Semiconductor device package
ADVANCED SEMICONDUCTOR ENG0 citations62
US11296025B2Apr 5, 2022
Interconnection structure and sensor package
ADVANCED SEMICONDUCTOR ENG0 citations62
US11262197B2Mar 1, 2022
Optical module and method of making the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US10910532B2Feb 2, 2021
Semiconductor device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations62
US10689249B2Jun 23, 2020
Semiconductor device package including a wall and a grounding ring exposed from the wall
ADVANCED SEMICONDUCTOR ENG1 citations62
US10424566B2Sep 24, 2019
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations62
US10381294B2Aug 13, 2019
Semiconductor package device
ADVANCED SEMICONDUCTOR ENG1 citations62
US11776862B2Oct 3, 2023
Lid structure and semiconductor device package including the same
ADVANCED SEMICONDUCTOR ENG0 citations61
US10804173B2Oct 13, 2020
Lid structure and semiconductor device package including the same
ADVANCED SEMICONDUCTOR ENG1 citations61
US10526200B2Jan 7, 2020
Semiconductor device package including cover including tilted inner sidewall
ADVANCED SEMICONDUCTOR ENG1 citations61
US12094995B2Sep 17, 2024
Optical device including lid having first and second cavity with inclined sidewalls
ADVANCED SEMICONDUCTOR ENG0 citations60
US11430906B2Aug 30, 2022
Optical device including lid having first and second cavity with inclined sidewalls
ADVANCED SEMICONDUCTOR ENG0 citations60
US11276797B2Mar 15, 2022
Optical device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations59
US10629787B2Apr 21, 2020
Lid and an optical device package having the same
ADVANCED SEMICONDUCTOR ENG0 citations52
US10508910B2Dec 17, 2019
Optical module and method of making the same
ADVANCED SEMICONDUCTOR ENG0 citations52
US10177283B2Jan 8, 2019
LED packages and related methods
ADVANCED SEMICONDUCTOR ENG0 citations51
US10069051B2Sep 4, 2018
Semiconductor package device and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG1 citations51
US9881845B1Jan 30, 2018
Electronic device, lid structure and package structure
ADVANCED SEMICONDUCTOR ENG0 citations51
US9850124B2Dec 26, 2017
Semiconductor device package for reducing parasitic light and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations51
US10453760B2Oct 22, 2019
Lid array panel, package with lid and method of making the same
ADVANCED SEMICONDUCTOR ENG0 citations49
US10862014B2Dec 8, 2020
Optical device package and method of manufacturing the same
ADVANCED SEMICONDUCTOR ENG0 citations41