P

Inventor

CHAN HSUN-WEI

TW29 patents
⚠️ This page may combine multiple inventors who share the name “CHAN HSUN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANCED SEMICONDUCTOR ENG

26 patents
US10396783B2Aug 27, 2019

Optical module, manufacturing method thereof and electronic apparatus

ADVANCED SEMICONDUCTOR ENG10 citations83
US11276806B2Mar 15, 2022

Semiconductor device package and method for manufacturing the same

ADVANCED SEMICONDUCTOR ENG4 citations71
US10436635B2Oct 8, 2019

Active optical component with passive optical component and encapsulant for an optical device and electrical device including the same

ADVANCED SEMICONDUCTOR ENG2 citations70
US12352602B2Jul 8, 2025

Optical module and method of making the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11835363B2Dec 5, 2023

Optical module and method of making the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US11588081B2Feb 21, 2023

Semiconductor device package

ADVANCED SEMICONDUCTOR ENG0 citations62
US11296025B2Apr 5, 2022

Interconnection structure and sensor package

ADVANCED SEMICONDUCTOR ENG0 citations62
US11262197B2Mar 1, 2022

Optical module and method of making the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US10910532B2Feb 2, 2021

Semiconductor device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations62
US10689249B2Jun 23, 2020

Semiconductor device package including a wall and a grounding ring exposed from the wall

ADVANCED SEMICONDUCTOR ENG1 citations62
US10424566B2Sep 24, 2019

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations62
US10381294B2Aug 13, 2019

Semiconductor package device

ADVANCED SEMICONDUCTOR ENG1 citations62
US11776862B2Oct 3, 2023

Lid structure and semiconductor device package including the same

ADVANCED SEMICONDUCTOR ENG0 citations61
US10804173B2Oct 13, 2020

Lid structure and semiconductor device package including the same

ADVANCED SEMICONDUCTOR ENG1 citations61
US10526200B2Jan 7, 2020

Semiconductor device package including cover including tilted inner sidewall

ADVANCED SEMICONDUCTOR ENG1 citations61
US12094995B2Sep 17, 2024

Optical device including lid having first and second cavity with inclined sidewalls

ADVANCED SEMICONDUCTOR ENG0 citations60
US11430906B2Aug 30, 2022

Optical device including lid having first and second cavity with inclined sidewalls

ADVANCED SEMICONDUCTOR ENG0 citations60
US11276797B2Mar 15, 2022

Optical device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations59
US10629787B2Apr 21, 2020

Lid and an optical device package having the same

ADVANCED SEMICONDUCTOR ENG0 citations52
US10508910B2Dec 17, 2019

Optical module and method of making the same

ADVANCED SEMICONDUCTOR ENG0 citations52
US10177283B2Jan 8, 2019

LED packages and related methods

ADVANCED SEMICONDUCTOR ENG0 citations51
US10069051B2Sep 4, 2018

Semiconductor package device and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG1 citations51
US9881845B1Jan 30, 2018

Electronic device, lid structure and package structure

ADVANCED SEMICONDUCTOR ENG0 citations51
US9850124B2Dec 26, 2017

Semiconductor device package for reducing parasitic light and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations51
US10453760B2Oct 22, 2019

Lid array panel, package with lid and method of making the same

ADVANCED SEMICONDUCTOR ENG0 citations49
US10862014B2Dec 8, 2020

Optical device package and method of manufacturing the same

ADVANCED SEMICONDUCTOR ENG0 citations41

CHAN HSUN-WEI

2 patents

ADVANCED SEMICONDUCTORY ENGINEERING INC

1 patent