Inventor

CHEN JEN-YI

TW37 patents

⚠️ This page may combine multiple inventors who share the name “CHEN JEN-YI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHEN JEN-YI

MERRY ELECTRONICS SHENZHEN CO LTD

Acoustic transducer with high sensitivity

MEMS microphone package structure having non-planar substrate and method of manufacturing same

Dual-diaphragm acoustic transducer

MEMS microphone package structure having an improved carrier and a method of manufacturing same

Piezoelectric transducer

Speaker

MEMS sensor

MEMS speaker

Multi-floor type MEMS microphone

Microphone module

Microphone module

Microphone structure

Speaker and MEMs actuator thereof

Micro-electro mechanical device with vibration sensor and micro-electro mechanical microphone

Vibration sensing assembly for bone conduction microphone

IND TECH RES INST

Sensor

Capacitive microphone and method for making the same

Electro-acoustic sensing device

MEMS structure with suspended microstructure that includes dielectric layer sandwiched by plural metal layers and the dielectric layer having an edge surrounded by peripheral metal wall

Manufacturing methods for micro-electromechanical system device having electrical insulating structure

Sensor

MERRY ELECTRONICS CO LTD

MEMS microphone packaging structure

Vibration sensor with pressure enhancement

Vibration sensor having vent for pressure enhancing member

Vibration sensor for obtaining signals with high signal-to-noise ratio

Semi-finished product of electronic device and electronic device

Electronic device

CHEN JEN-YI

Methods for making capacitive microphone

Method for forming semiconductor device

NAT UNIV TSING HUA

Manufacturing method of a condenser microphone

Condenser microphone and manufacturing method thereof

HSU YU WEN

Micro-electromechanical system device having electrical insulating structure and manufacturing methods

SONG PO-HSUN

Acoustic transducer and microphone using the same

MERRY ELECTRONICS SUZHOU CO

Air pressure sensing system

CHEN KUN-EI

System and method of monitoring and controlling atomic layer deposition of tungsten

MERRY ELECTRONICS(SHENZHEN) CO LTD

MEMS chip package

ZILLTEK TECHNOLOGY CORP

Resonant structure in micro electro mechanical systems