Inventor

LAURO PAUL A

US74 patents

⚠️ This page may combine multiple inventors who share the name “LAURO PAUL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAURO PAUL A

IBM

Test probe having elongated conductor embedded in an elostomeric material which is mounted on a space transformer

Three dimensional high performance interconnection package

Double solder bumps on substrates for low temperature flip chip bonding

Cooling apparatus with cold plate formed in situ on a surface to be cooled

Method of forming a three dimensional high performance interconnection package

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Cooling apparatus and method of fabrication thereof with a cold plate formed in situ on a surface to be cooled

Patterned metal thermal interface

Injection molded solder method for forming solder bumps on substrates

Land grid array fabrication using elastomer core and conducting metal shell or mesh

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Electrical connector design and contact geometry and method of use thereof and methods of fabrication thereof

Interposer with electrical contact button and method

Method of making a gallium nitride device

Protective capping layer for spalled gallium nitride

Forming an array of metal balls or shapes on a substrate

Structure and methods of processing for solder thermal interface materials for chip cooling

Solder interconnect structure and method using injection molded solder

Structure of UBM and solder bumps and methods of fabrication

Method of making a gallium nitride device

Protective capping layer for spalled gallium nitride

Method for facilitating crack initiation during controlled substrate spalling

Interposer with electrical contact button and method

Method of making a gallium nitride device

Simplified process for vertical LED manufacturing

Method for improving surface quality of spalled substrates

Double solder bumps on substrates for low temperature flip chip bonding

Fixed curvature force loading of mechanically spalled films

Injection molded solder method for forming solder bumps on substrates

Micro-fluidic injection molded solder (IMS)

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Interconnections for flip-chip using lead-free solders and having reaction barrier layers

Land grid array fabrication using elastomer core and conducting metal shell or mesh

BEDELL STEPHEN W

Thin substrate fabrication using stress-induced substrate spalling

Thin substrate fabrication using stress-induced spalling

Removal of stressor layer from a spalled layer and method of making a bifacial solar cell using the same

Edge-exclusion spalling method for improving substrate reusability

Method for controlled layer transfer

Spalling utilizing stressor layer portions

Method for improving quality of spalled material layers

GRUBER PETER A

Double solder bumps on substrates for low temperature flip chip bonding

Direct IMS (injection molded solder) without a mask for forming solder bumps on substrates

HOUGHAM GARETH

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

Self orienting micro plates of thermally conducting material as component in thermal paste or adhesive

BUCHWALTER STEPHEN L

Micro-fluidic injection molded solder (IMS)

FURMAN BRUCE K

Patterned metal thermal interface

INTERNAT BUSINSS MACHINES CORP

Micro-fluidic injection molded solder (IMS)

KANG SUNG K

Electromigration-resistant under-bump metallization of nickel-iron alloys for Sn-rich solder bumps in Pb-free flip-clip

GLOBALFOUNDRIES INC

Double solder bumps on substrates for low temperature flip chip bonding