Inventor

TULLIDGE LEE H

US3 patents

⚠️ This page may combine multiple inventors who share the name “TULLIDGE LEE H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TULLIDGE LEE H

2 patents

US8112884B2Feb 14, 2012

Method for providing an efficient thermal transfer through a printed circuit board

TULLIDGE LEE H8 citations76

US8575492B2Nov 5, 2013

Hole in pad thermal management

TULLIDGE LEE H2 citations54

HONEYWELL INT INC

1 patent

US7193863B2Mar 20, 2007

Electronics packaging assembly with parallel circuit boards and a vibration stiffener

HONEYWELL INT INC5 citations51