Inventor
CHEN GUAN-YU
TW41 patents
⚠️ This page may combine multiple inventors who share the name “CHEN GUAN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
13 patentsUS10128195B2Nov 13, 2018
Substrate design with balanced metal and solder resist density
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11502032B2Nov 15, 2022
Chip package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9659896B2May 23, 2017
Interconnect structures for wafer level package and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11416666B1Aug 16, 2022
Integrated circuit and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US9425117B2Aug 23, 2016
Substrate design with balanced metal and solder resist density
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations63
US11775726B2Oct 3, 2023
Integrated circuit having latch-up immunity
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10872855B2Dec 22, 2020
Chip package and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10366971B2Jul 30, 2019
Pre-applying supporting materials between bonded package components
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10043774B2Aug 7, 2018
Integrated circuit packaging substrate, semiconductor package, and manufacturing method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9966346B2May 8, 2018
Bump structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9899288B2Feb 20, 2018
Interconnect structures for wafer level package and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9812405B2Nov 7, 2017
Semiconductor package and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations52
US9431351B2Aug 30, 2016
Semiconductor package and manufacturing method of the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
IND TECH RES INST
7 patentsUS10141378B2Nov 27, 2018
Light emitting device free of TFT and chiplet
IND TECH RES INST2 citations71
US9559326B2Jan 31, 2017
Light emitting element
IND TECH RES INST1 citations51
US9570518B2Feb 14, 2017
Light emitting element
IND TECH RES INST0 citations50
US9331302B2May 3, 2016
Blue light emitting device and light emitting device
IND TECH RES INST0 citations48
US9741959B1Aug 22, 2017
Light emitting device
IND TECH RES INST0 citations40
US9704924B2Jul 11, 2017
Light emitting device
IND TECH RES INST0 citations40
US9472599B2Oct 18, 2016
Light emitting device
IND TECH RES INST0 citations40
TAIWAN SEMICONDUCTOR MFG
4 patentsUS9153550B2Oct 6, 2015
Substrate design with balanced metal and solder resist density
TAIWAN SEMICONDUCTOR MFG7 citations84
US9306495B2Apr 5, 2016
Oscillator circuit and related method
TAIWAN SEMICONDUCTOR MFG4 citations66
US9111817B2Aug 18, 2015
Bump structure and method of forming same
TAIWAN SEMICONDUCTOR MFG2 citations63
US9293404B2Mar 22, 2016
Pre-applying supporting materials between bonded package components
TAIWAN SEMICONDUCTOR MFG0 citations52
REALTEK SEMICONDUCTOR CORP
3 patentsUS10630273B2Apr 21, 2020
Clock circuit having a pulse width adjustment module
REALTEK SEMICONDUCTOR CORP5 citations70
US9621158B2Apr 11, 2017
Switch and multiplexer including the same
REALTEK SEMICONDUCTOR CORP2 citations70
US9673800B2Jun 6, 2017
Analog switch circuit applicable to high frequency signal
REALTEK SEMICONDUCTOR CORP0 citations40
AU OPTRONICS CORP
2 patentsTENNVAC INC
2 patentsUS10170827B2Jan 1, 2019
Housing structure having conductive adhesive antenna and conductive adhesive antenna thereof
TENNVAC INC0 citations48
US10090575B2Oct 2, 2018
Method of manufacturing a waveguide assembly by adhesively bonding two waveguide units and a waveguide structure formed therefrom
TENNVAC INC0 citations27