Inventor
MORI SATORU
JP29 patents
⚠️ This page may combine multiple inventors who share the name “MORI SATORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI MATERIALS CORP
16 patentsUS8384083B2Feb 26, 2013
Thin-film transistor having high adhesive strength between barrier film and drain electrode and source electrode films
MITSUBISHI MATERIALS CORP17 citations82
US5997704ADec 7, 1999
Sputtering target for depositing ferroelectric film, method for preparing the same, and method for preparing a DRAM using the same
MITSUBISHI MATERIALS CORP13 citations69
US11427888B2Aug 30, 2022
Sputtering target material
MITSUBISHI MATERIALS CORP1 citations54
US10889889B2Jan 12, 2021
High purity copper sputtering target material
MITSUBISHI MATERIALS CORP0 citations53
US10822691B2Nov 3, 2020
Cu—Ga alloy sputtering target and method of manufacturing Cu—Ga alloy sputtering target
MITSUBISHI MATERIALS CORP0 citations52
US8796144B2Aug 5, 2014
Method of forming thin film interconnect and thin film interconnect
MITSUBISHI MATERIALS CORP0 citations52
US10443113B2Oct 15, 2019
Sputtering target for forming protective film and multilayer wiring film
MITSUBISHI MATERIALS CORP0 citations50
US10351946B2Jul 16, 2019
Sputtering target and method for producing same
MITSUBISHI MATERIALS CORP0 citations50
US10017850B2Jul 10, 2018
Cu—Ga alloy sputtering target, and method for producing same
MITSUBISHI MATERIALS CORP0 citations50
US9748080B2Aug 29, 2017
Cu—Ga alloy sputtering target and method for producing same
MITSUBISHI MATERIALS CORP0 citations50
US10770274B2Sep 8, 2020
Copper alloy sputtering target and manufacturing method of copper alloy sputtering target
MITSUBISHI MATERIALS CORP0 citations49
US10062552B2Aug 28, 2018
Copper alloy sputtering target and manufacturing method of copper alloy sputtering target
MITSUBISHI MATERIALS CORP0 citations49
US9518320B2Dec 13, 2016
Copper alloy sputtering target
MITSUBISHI MATERIALS CORP0 citations49
US10646917B2May 12, 2020
Copper ingot, copper wire material, and method for producing copper ingot
MITSUBISHI MATERIALS CORP0 citations45
US10538059B2Jan 21, 2020
Sputtering target for forming protective film, and laminated wiring film
MITSUBISHI MATERIALS CORP0 citations43
US9543128B2Jan 10, 2017
Sputtering target for forming protective film and laminated wiring film
MITSUBISHI MATERIALS CORP0 citations42