Inventor
HUANG CHIAO-LING
TW5 patents
Patents
5 patentsUS11569162B2Jan 31, 2023
Chip on film package with reinforcing sheet and manufacturing method of chip on film package with reinforcing sheet
NOVATEK MICROELECTRONICS CORP0 citations58
US11502052B2Nov 15, 2022
Chip structure
NOVATEK MICROELECTRONICS CORP0 citations54
US10777498B2Sep 15, 2020
Chip on film package with reinforcing sheet
NOVATEK MICROELECTRONICS CORP0 citations48
US10692815B2Jun 23, 2020
Chip on glass package assembly
NOVATEK MICROELECTRONICS CORP0 citations45
US10734344B2Aug 4, 2020
Chip structure
NOVATEK MICROELECTRONICS CORP0 citations44