Inventor

ENGL REIMUND

DE18 patents

⚠️ This page may combine multiple inventors who share the name “ENGL REIMUND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ENGL REIMUND

INFINEON TECHNOLOGIES AG

Semiconductor device with a metallic carrier and two semiconductor chips applied to the carrier

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

Semiconductor device with leadframe including a diffusion barrier

Pentaarylcyclopentadienyl units as active units in resistive memory elements

Chip package, method of forming a chip package and method of forming an electrical contact

Memory cell, method for the production thereof and use of a composition therefor

Resistive memory for low-voltage applications

Method for producing a power semiconductor module comprising surface-mountable flat external contacts

Semiconductor module

Chip package and method of forming a chip package

Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package

Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound

MAHLER JOACHIM

Integrated circuit device and method for the production thereof

Semiconductor device including isolation layer

MEINHOLD DIRK

Protection layers for conductive pads and methods of formation thereof

OTREMBA RALF

Semiconductor device

EWE HENRIK

Semiconductor device