Inventor

GATTERBAUER JOHANN

DE19 patents

⚠️ This page may combine multiple inventors who share the name “GATTERBAUER JOHANN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

GATTERBAUER JOHANN

INFINEON TECHNOLOGIES AG

Methods for making a semiconductor chip device

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

Semiconductor chip device

Conductive pads and methods of formation thereof

Chip package, method of forming a chip package and method of forming an electrical contact

Method of forming an aluminum oxide layer, metal surface with aluminum oxide layer, and electronic device

Chip package and method of forming a chip package

Chip package and method of forming a chip package

Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

Conductive pads and methods of formation thereof

Semiconductor devices for integration with light emitting chips and modules thereof

Semiconductor devices for integration with light emitting chips and modules thereof

Semiconductor devices for integration with light emitting chips and modules thereof

Method of forming a layer structure, layer structure, method of forming a contact structure, method of forming a chip package, and chip package

Barrier for power metallization in semiconductor devices

GATTERBAUER JOHANN

Method for manufacturing a metal pad structure of a die, a method for manufacturing a bond pad of a chip, a die arrangement and a chip arrangement

Contact pads with sidewall spacers and method of making contact pads with sidewall spacers

Pad sidewall spacers and method of making pad sidewall spacers