P

Inventor

KOERNER HEINRICH

DE35 patents
⚠️ This page may combine multiple inventors who share the name “KOERNER HEINRICH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INFINEON TECHNOLOGIES AG

24 patents
US7948064B2May 24, 2011

System on a chip with on-chip RF shield

INFINEON TECHNOLOGIES AG29 citations92
US7936052B2May 3, 2011

On-chip RF shields with backside redistribution lines

INFINEON TECHNOLOGIES AG19 citations84
US8367514B2Feb 5, 2013

Integrated circuit with capacitor and method for the production thereof

INFINEON TECHNOLOGIES AG9 citations83
US6940720B2Sep 6, 2005

Integrated circuit having a thermally shielded electric resistor trace

INFINEON TECHNOLOGIES AG12 citations83
US7667256B2Feb 23, 2010

Integrated circuit arrangement having a plurality of conductive structure levels and capacitor, and a method for producing the integrated circuit arrangement

INFINEON TECHNOLOGIES AG8 citations82
US6958509B2Oct 25, 2005

Integrated semiconductor product comprising a metal-insulator-metal capacitor

INFINEON TECHNOLOGIES AG15 citations82
US10978418B2Apr 13, 2021

Method of forming an electrical contact and method of forming a chip package with a metal contact structure and protective layer

INFINEON TECHNOLOGIES AG2 citations71
US10461056B2Oct 29, 2019

Chip package and method of forming a chip package with a metal contact structure and protective layer, and method of forming an electrical contact

INFINEON TECHNOLOGIES AG2 citations71
US8049336B2Nov 1, 2011

Interconnect structure

INFINEON TECHNOLOGIES AG2 citations63
US7960832B2Jun 14, 2011

Integrated circuit arrangement with layer stack

INFINEON TECHNOLOGIES AG3 citations63
US8748287B2Jun 10, 2014

System on a chip with on-chip RF shield

INFINEON TECHNOLOGIES AG3 citations62
US12033972B2Jul 9, 2024

Chip package, method of forming a chip package and method of forming an electrical contact

INFINEON TECHNOLOGIES AG0 citations61
US7964494B2Jun 21, 2011

Integrated connection arrangements

INFINEON TECHNOLOGIES AG3 citations61
US7692266B2Apr 6, 2010

Integrated circuit with capacitor and method for the production thereof

INFINEON TECHNOLOGIES AG3 citations61
US7656037B2Feb 2, 2010

Integrated circuit with improved component interconnections

INFINEON TECHNOLOGIES AG4 citations61
US7233053B2Jun 19, 2007

Integrated semiconductor product with metal-insulator-metal capacitor

INFINEON TECHNOLOGIES AG2 citations60
US9390973B2Jul 12, 2016

On-chip RF shields with backside redistribution lines

INFINEON TECHNOLOGIES AG1 citations52
US9312172B2Apr 12, 2016

Semiconductor device and method for making same

INFINEON TECHNOLOGIES AG0 citations51
US9263328B2Feb 16, 2016

Semiconductor device and method for making same

INFINEON TECHNOLOGIES AG0 citations51
US9941181B2Apr 10, 2018

Chip package and method of forming a chip package

INFINEON TECHNOLOGIES AG0 citations50
US9543199B2Jan 10, 2017

Long-term heat treated integrated circuit arrangements and methods for producing the same

INFINEON TECHNOLOGIES AG0 citations47
US10672678B2Jun 2, 2020

Method for forming a chip package with compounds to improve the durability and performance of metal contact structures in the chip package

INFINEON TECHNOLOGIES AG0 citations39
US10497634B2Dec 3, 2019

Chip package comprising a chemical compound and a method of forming a chip package comprising a chemical compound

INFINEON TECHNOLOGIES AG0 citations39
US10867893B2Dec 15, 2020

Semiconductor devices and methods for forming a semiconductor device

INFINEON TECHNOLOGIES AG0 citations38

SIEMENS AG

3 patents

BARTH HANS-JOACHIM

3 patents

KOERNER HEINRICH

1 patent

HELNEDER JOHANN

1 patent

MEINHOLD DIRK

1 patent

AUBEL OLIVER

1 patent

HOMMEL MARTINA

1 patent