Inventor
LEE SEOK-HYUN
KR27 patents
⚠️ This page may combine multiple inventors who share the name “LEE SEOK-HYUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
18 patentsUS10847468B2Nov 24, 2020
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD9 citations83
US11710701B2Jul 25, 2023
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD1 citations72
US10622320B2Apr 14, 2020
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD4 citations72
US9508657B2Nov 29, 2016
Semiconductor package
SAMSUNG ELECTRONICS CO LTD4 citations72
US11652090B2May 16, 2023
Semiconductor package and method for fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations71
US11758284B2Sep 12, 2023
Image processors and image processing methods
SAMSUNG ELECTRONICS CO LTD2 citations69
US11025816B2Jun 1, 2021
Image processors and image processing methods
SAMSUNG ELECTRONICS CO LTD3 citations69
US12170249B2Dec 17, 2024
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11462464B2Oct 4, 2022
Fan-out semiconductor package having redistribution line structure
SAMSUNG ELECTRONICS CO LTD0 citations62
US11355440B2Jun 7, 2022
Semiconductor package including interposer
SAMSUNG ELECTRONICS CO LTD0 citations62
US11715645B2Aug 1, 2023
Method for fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11322368B2May 3, 2022
Method for fabricating semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations61
US11101231B2Aug 24, 2021
Semiconductor package and method of manufacturing the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12052513B2Jul 30, 2024
Image processors and image processing methods
SAMSUNG ELECTRONICS CO LTD0 citations59
US8927340B2Jan 6, 2015
Double-sided adhesive tape, semiconductor packages, and methods of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations52
US10879163B2Dec 29, 2020
Fan-out semiconductor package having redistribution line structure
SAMSUNG ELECTRONICS CO LTD0 citations51
US11791286B2Oct 17, 2023
Semiconductor device and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations49
US9093439B2Jul 28, 2015
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations42