Inventor
CHIU YI-HSIANG
CN10 patents
⚠️ This page may combine multiple inventors who share the name “CHIU YI-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
J METRICS TECH CO LTD
6 patentsUS11075072B2Jul 27, 2021
Wafer scale ultrasonic sensing device and manufacturing method thereof
J METRICS TECH CO LTD3 citations68
US11460341B2Oct 4, 2022
Wafer scale ultrasonic sensor assembly and method for manufacturing the same
J METRICS TECH CO LTD3 citations67
US11806751B2Nov 7, 2023
Wafer level ultrasonic device and manufacturing method thereof
J METRICS TECH CO LTD1 citations58
US11478822B2Oct 25, 2022
Wafer level ultrasonic chip module having suspension structure and manufacturing method thereof
J METRICS TECH CO LTD0 citations47
US10657349B2May 19, 2020
Ultrasonic module and method for manufacturing the same
J METRICS TECH CO LTD0 citations47
US11130674B2Sep 28, 2021
Integrated package structure for MEMS element and ASIC chip and method for manufacturing the same
J METRICS TECH CO LTD0 citations46
SONICMEMS ZHENGZHOU TECH CO LTD
3 patentsUS11548031B2Jan 10, 2023
Array-type ultrasonic sensor
SONICMEMS ZHENGZHOU TECH CO LTD0 citations44
US11590536B2Feb 28, 2023
Wafer level ultrasonic chip module and manufacturing method thereof
SONICMEMS ZHENGZHOU TECH CO LTD0 citations43
US12571675B2Mar 10, 2026
Ultrasonic sensing element assembly and ultrasonic sensing element
SONICMEMS ZHENGZHOU TECH CO LTD0 citations37