Inventor

JUANG JING-YE

TW7 patents

⚠️ This page may combine multiple inventors who share the name “JUANG JING-YE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

3 patents

US12387945B2Aug 12, 2025

Semiconductor structures including glass core layer and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63

US12347758B2Jul 1, 2025

Dual-underfill encapsulation for packaging and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62

US12489043B2Dec 2, 2025

Reconstructed substrates for high I/O counts application and methods for forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61

NATIONAL YANG MING CHIAO TUNG UNIV

2 patents

US11145619B2Oct 12, 2021

Electrical connecting structure having nano-twins copper and method of forming the same

NATIONAL YANG MING CHIAO TUNG UNIV2 citations68

US11715721B2Aug 1, 2023

Electrical connecting structure having nano-twins copper

NATIONAL YANG MING CHIAO TUNG UNIV0 citations58

LU SU-TSAI

1 patent

US9184153B2Nov 10, 2015

Chip stack structure and method for fabricating the same

LU SU-TSAI15 citations80

IND TECH RES INST

1 patent

US8384215B2Feb 26, 2013

Wafer level molding structure

IND TECH RES INST0 citations51