Inventor
HUANG SHIH-YA
TW12 patents
⚠️ This page may combine multiple inventors who share the name “HUANG SHIH-YA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
11 patentsUS11211360B2Dec 28, 2021
Passive device module, semiconductor package including the same, and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11302649B2Apr 12, 2022
Semiconductor device with shielding structure for cross-talk reduction
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations74
US11923315B2Mar 5, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11637097B2Apr 25, 2023
Method of manufacturing package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11195817B2Dec 7, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11062998B2Jul 13, 2021
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10811404B2Oct 20, 2020
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269728B2Apr 23, 2019
Semiconductor device with shielding structure for cross-talk reduction
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12489062B2Dec 2, 2025
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11222883B2Jan 11, 2022
Package structure and method of manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10692817B2Jun 23, 2020
Semiconductor device with shielding structure for cross-talk reduction
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62