Inventor
HSU CHIN-TENG
TW12 patents
⚠️ This page may combine multiple inventors who share the name “HSU CHIN-TENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
6 patentsUS6680531B2Jan 20, 2004
Multi-chip semiconductor package
SILICONWARE PRECISION INDUSTRIES CO LTD13 citations78
US6979886B2Dec 27, 2005
Short-prevented lead frame and method for fabricating semiconductor package with the same
SILICONWARE PRECISION INDUSTRIES CO LTD7 citations71
US7410835B2Aug 12, 2008
Method for fabricating semiconductor package with short-prevented lead frame
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations61
US7126229B2Oct 24, 2006
Wire-bonding method and semiconductor package using the same
SILICONWARE PRECISION INDUSTRIES CO LTD3 citations59
US6806565B2Oct 19, 2004
Lead-frame-based semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD2 citations58
US7008826B2Mar 7, 2006
Lead-frame-based semiconductor package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations47
LIH YEU SENG IND CO LTD
4 patentsUS7530842B1May 12, 2009
High-frequency connector assembly
LIH YEU SENG IND CO LTD8 citations81
US7416416B1Aug 26, 2008
High frequency connector
LIH YEU SENG IND CO LTD11 citations81
US7217160B2May 15, 2007
Adapter for high frequency signal transmission
LIH YEU SENG IND CO LTD9 citations71
US11342704B2May 24, 2022
Signal connector positioning structure and signal line fabrication method
LIH YEU SENG IND CO LTD0 citations49