Inventor

BRODOCEANU DANIEL

IE40 patents

⚠️ This page may combine multiple inventors who share the name “BRODOCEANU DANIEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BRODOCEANU DANIEL

FACEBOOK TECH LLC

Laser-induced selective heating for microLED placement and bonding

Rigid pickup head with conformable layer

Method for polymer-assisted chip transfer

Etchant-accessible carrier substrate for display manufacture

Dry-etching of carrier substrate for microLED microassembly

Bonding corners of light emitting diode chip to substrate using laser

Pickup head with photocurable polymers for assembling light emitting diodes

Molded etch masks

Probe card for efficient screening of highly-scaled monolithic semiconductor devices

Curing pre-applied and plasma-etched underfill via a laser

Interconnect with nanotube fitting

Flexible interconnect using conductive adhesive

Curved pillar interconnects

Elastomeric layer fabrication for light emitting diodes

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Liquid crystalline elastomer for pick and place of semiconductor devices

Magnetic clamping interconnects

Fluidic pick-up head for assembling light emitting diodes

Fabricating parabolic-shaped LEDs

Microlens arrays for parallel micropatterning

Bonding dummy electrodes of light emitting diode chip to substrate

Micro light emitting diode with remnants of fabrication substrate for structural support

Optics formation using pick-up tools

Monitoring dry-etching of polymer layer for transferring semiconductor devices

Atomic force microscopy tips for interconnection

Selectively bonding light-emitting devices via a pulsed laser

Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Using underfill or flux to promote placing and parallel bonding of light emitting diodes

Elastomeric layer fabrication for light emitting diodes

Laser lift-off masks

Method for polymer-assisted chip transfer

Elastomeric layer fabrication for light emitting diodes

Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers

Dynamic adjustment of placement parameters for light emitting diodes

Method for polymer-assisted chip transfer

META PLATFORMS TECH LLC

Hybrid interconnect for laser bonding using nanoporous metal tips

Detection of force applied by pick-up tool for transferring semiconductor devices

Application of underfill via centrifugal force

Bridge pick-up head for transferring semiconductor devices