Inventor

WU JEB

US17 patents

⚠️ This page may combine multiple inventors who share the name “WU JEB”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WU JEB

FACEBOOK TECH LLC

Bonding corners of light emitting diode chip to substrate using laser

Curing pre-applied and plasma-etched underfill via a laser

Interconnect with nanotube fitting

Transparent circuit boards with multilayered traces

Flexible interconnect using conductive adhesive

Curved pillar interconnects

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Magnetic clamping interconnects

Bonding dummy electrodes of light emitting diode chip to substrate

Selectively bonding light-emitting devices via a pulsed laser

Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers

Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating

Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers

MICROSOFT TECHNOLOGY LICENSING LLC

Display device with optics for brightness uniformity tuning having DOE optically coupled to receive light at central and peripheral regions

Left and right eye optical paths with shared optical element for head-mounted display device

Light engine with lenticular microlenslet arrays

META PLATFORMS TECH LLC

Hybrid interconnect for laser bonding using nanoporous metal tips