Inventor
CHIO ZHENG SUNG
IE18 patents
⚠️ This page may combine multiple inventors who share the name “CHIO ZHENG SUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FACEBOOK TECH LLC
14 patentsUS11255529B1Feb 22, 2022
Bonding corners of light emitting diode chip to substrate using laser
FACEBOOK TECH LLC5 citations72
US11579182B1Feb 14, 2023
Probe card for efficient screening of highly-scaled monolithic semiconductor devices
FACEBOOK TECH LLC2 citations71
US11563142B2Jan 24, 2023
Curing pre-applied and plasma-etched underfill via a laser
FACEBOOK TECH LLC1 citations71
US11417792B1Aug 16, 2022
Interconnect with nanotube fitting
FACEBOOK TECH LLC2 citations71
US11349053B1May 31, 2022
Flexible interconnect using conductive adhesive
FACEBOOK TECH LLC5 citations71
US11239400B1Feb 1, 2022
Curved pillar interconnects
FACEBOOK TECH LLC2 citations71
US11374148B2Jun 28, 2022
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
FACEBOOK TECH LLC2 citations70
US11296268B1Apr 5, 2022
Magnetic clamping interconnects
FACEBOOK TECH LLC4 citations70
US11276672B1Mar 15, 2022
Bonding dummy electrodes of light emitting diode chip to substrate
FACEBOOK TECH LLC1 citations62
US10989735B2Apr 27, 2021
Atomic force microscopy tips for interconnection
FACEBOOK TECH LLC0 citations62
US11557692B2Jan 17, 2023
Selectively bonding light-emitting devices via a pulsed laser
FACEBOOK TECH LLC0 citations60
US11575069B2Feb 7, 2023
Employing deformable contacts and pre-applied underfill for bonding LED devices via lasers
FACEBOOK TECH LLC0 citations59
US11735689B2Aug 22, 2023
Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heating
FACEBOOK TECH LLC0 citations58
US11404600B2Aug 2, 2022
Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasers
FACEBOOK TECH LLC0 citations50